What To Expect When Stencil Printing Flux
In a perfect world, materials printed through a circular stencil aperture would be column-like with a flat top. When you look closely at a printed fl...
In a perfect world, materials printed through a circular stencil aperture would be column-like with a flat top. When you look closely at a printed fl...
We are looking into a way to deposit solder on a typical die attach machine without using die-attach paste – and without a tooling change. This...
Have you ever been so proud of something that you just wanted to go yell out your feelings from a rooftop? Here’s the deal – our spheres ...
Soft solders are used instead of hard solders in applications were there are large coefficient of thermal expansion mismatches between semiconductor d...
The shape of your solder joint below a flip-chip or BGA is controlled by the surface tension of the alloy, the activity of flux used, the tension or c...
For the second half of Solder Paste Transfer Efficiency, I would like to talk about tolerances and the Rule of 10% Standard Deviation (σ). From ...
With the Strategies in Light show just behind us, I thought it a good time to discuss a little further the use of metal thermal interface materials......
Do you have a 2’ x 3’ area on the wall of your office or cubical for the latest new and improved Indium Corporation Wall Chart? a......
Just incase you were wondering, here are the wetting results you can expect when soldering Pb-free spheres to different surface finishes. The chart sh...
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...
Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefu...
A great Indium Knowledge Base question came from a customer last week for “recommendations on solder paste height versus component pitch…&...