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Spin Coating for Beginners

Category:
  • Flux
  • Indium Corporation
  • Liquid Flux
  • Step 1, Liquid flux is deposited onto the center of the wafer

    Step 1, Liquid flux is deposited onto the center of the wafer

    Step 2, A low rpm initial spin pulls flux from the center across the wafer surface

    Step 2, A low rpm initial spin pulls flux from the center across the wafer surface

    Step 3, A high rpm spin ejects excess flux - leaving a thin layer on the wafer

    Step 3, A high rpm spin ejects excess flux - leaving a thin layer on the wafer

    Spin coating is an amazingly simple way to apply flux to a (generally round) substrate.  Most commonly used in wafer processing, spin coating can be used as a more uniform alternative to spraying liquid fluxes onto wafers for electroplated bump formation.  Here is an image tutorial to introduce the process: