Starvation Voids: When too little (paste) becomes too much (voiding)
Diving deeper into exploring the types of voids and how they occur, some important interactions between material and process variables appear....
QFN Voiding
Avoid the Void®: Beyond QFN Voiding
Kim Flanagan, Technical Support Engineer, and Phil Zarrow discuss how to Avoid the Void® by looking at four non-QFN void types—Kirkendall (c...
How Process Variables Affect Variation in QFN Voiding
Indium Corporation's been doing extensive testing on the effect of different process variables on voiding and QFNs... ...
Process Considerations for QFN Voiding in SMT Electronics Assembly (3/3)
This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of Avoid the Void®......
Process Considerations for QFN Voiding in SMT Electronics Assembly (2/3)
This is part two of a three-part series. This video is for anyone interested in the design of experiment aspect of Avoid the Void®......
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Reflow Profile
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram.&nbs...
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Design
Learn about the many factors associated with BTC voiding reduction. ...
Using Solder Preforms to Reduce Voiding in BTCs
Voiding underneath BTCs is greatly reduced using a novel process technique from the Indium Corporation....
Causes and Solutions to Voiding in Die-Attach
This video is for engineers challenged by voiding in die-attach electronics assembly applications. It covers causes and methods to Avoid the Void®...
Voiding in Die-Attach Electronics Assembly
This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences betw...
To Minimize BTC Voiding, Start with the Right Solder Paste
Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six S...
Avoid the Void®
Voiding is a complex problem with complex solutions. It isn't always just a matter of switching out the solder paste and finding the solution.&nbs...
Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void®
For process engineers hoping to reduce voiding in electronics assembly, watch as I discuss the reliability of Indium10.1 and Indium8.9HF and how they ...
Reducing Voiding in Bottom-Terminated Components Using Solder Fortification® Preforms
Watch as I discuss the challenge of voiding in bottom-terminated components - and how to Avoid the Void®....
Avoid the Void® Using Heat-Spring Metal Thermal Interface Materials
Watch as I discuss voiding in thermal management and how you can Avoid the Void®....
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Solder Paste
Solder paste properties have a large effect on voiding. I dig into this area deeply and talk about how we can minimize large ground plane solder...
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Stencil Design
We can minimize large ground plane solder voiding in electronics assembly by modifying stencil design. ...
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Environment
Voiding beneath Large Ground Planes in Electronics Assembly can be minimized by optimizing the assembly environment. Learn how....
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Surface Finish
Did you know that the right PWB surface finish can minimize large ground plane solder voiding in electronics assembly? I'll tell you how....
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Ishikawa Diagram
Electronics manufacturers can AVOID THE VOID® using statistical tools like the Ishikawa diagram. Map out your process. Create an excellent visual ...