Minimizing Tombstoning
Folks, This post is an excerpt from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Introduction: Printed...
Folks, This post is an excerpt from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Introduction: Printed...
Folks, I am presenting a workshop on Defeating Defects at SMTAI on October 31. This workshop is based on the recently published booklet The Printed Ci...
Folks, Chris Nash and I (supported by an army of Indium Corporation’s outstanding engineers) wrote a booklet on eliminating solder defects. The ...
Dr. Ron introduces a new book to help electronics assembly process engineers to troubleshoot everyday assembly defects and challenges. ...
Patty explains why quality more than pays for itself when it comes to solder paste - and she has graphs to prove it....
Brook Sandy-Smith and Phil Zarrow preview some of the events they are looking forward to at SMTAI 2017 ...
This video is for anyone interested in mitigating head-in-pillow and non-wet open defects. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, head-...