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Theory of “Ball Drop” Sphere Placement

After transferring flux, align the stencil

After transferring flux, align the stencil

Setup print parameters to minimize doubles and missing solder spheres

Setup print parameters to minimize doubles and missing solder spheres

Remove stencil, substrate/die should be ready for inspection and reflow

Remove stencil, substrate/die should be ready for inspection and reflow

 

 

Spheres can be placed by many methods.  Depending on the scale of production, spheres are placed by printing, vacuum transfer, jetting, pick and place nozzles, and even tweezers.  These methods are used to align solder spheres on substrates or die for subsequent soldering.

 

Companies which currently make ‘ball drop’ attachments for standard printing equipment include DEK and Speedline.  There are also specialized machines that perform this stencil printing operation as well as prior flux transfer steps.

 

If you are interested in learning more about solder spheres and the way they are applied Click Here or call us at (315) 853-4900