SAC305 May Not Become De-Facto Standard
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. Wi...
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. Wi...
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...
Folks, Intel announced that they now produce lead-free flip chip solder joints in their 45 nm technology. You will recall that flip chip solder joints...
Folks, For some years I have shared my Excel spreadsheet that calculates the density of alloys. I am pleased that I still get requests for it. Such re...
Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and......
Folks, The technique to calculate density of an alloy still attracts interest about a year after I first discussed it. Although I am pleased to shar...
Folks, People in the solder and leadfree world still do not understand the prime reason for RoHS: To make recycling easier. A recent article about Swa...
Folks, I attended the IPC/Sodertec RoHS Conference in Malmo, Sweden on April 25-27. It was the last major European RoHS Conference before RoHS goes in...
Folks, My Indium colleague Jim Slattery, pointed out an interesting article in Electronic Design. After the article, some people sent in responses. A ...
Haibing writes: Question 1: My questions are centered around RoHS judgments. That is, how I can judge whether a contract manufacturer is RoHS c...
Folks: A reader writes: Dr. Ron I attended your seminars last year at the SMTAI Technical Conference in Chicago and Boston and discussed with you LF i...
Folks, My friend and colleague Jim Hall of ITM pointed out that the reliability of “mixed” (i.e. lead free and leaded solder and fi...