Indium Corporation - Mailchimp

Wafer-Level Microsphere Bumping (Microspheres)

Microsphere quality is especially important for bumping wafers.  The dimensional tolerance of microspheres impacts the bump co-planarity across a wafer surface.  In short, more precise spheres directly influence the quality of bumps on the die.  This will of course increase process yield since the spheres will all be closer to the pads they are being soldered to.