Dr. Ron's Venture Outsource Article on Occam Raises Interest

Folks,

Mark Zetter, asked me to write an article about Occam for Venture Outsource. The article Mark tells me has been one of their most popular recently.

BTW, the image above, from PC Magazine (October 2, 2007 p 74), is of a Gigabyte motherboard. Remembering that the Occam process coats all components with encapsulant. I’ll bet this moterboard would be a challenge to manufacuture with Occam!

Cheers,

Dr. Ron

Posted by Dr. Ron Lasky on October 9th, 2007 at 5:53 PM

Comments (add your comment)

  1. Joseph Fjelstad:

    Dear Ron,

    Thank you for your continuing interest in Occam. You have become one the most consistent commentors on the technology and we at Verdant Electronics (www.verdantelectronics.com) are honored by your attention.

    The First International Occam Developers Conference was held yesterday October 16 and was attended by enthusiastic individuals from 4 continents. You had previously asked for a savings estimate and the consensus is coming in at 25-35% excluding electronic components.

    I appreciate the example you have shown and trust that you do not think that the Occam process was being targeted to replace everything in electronics overnight. Occam will find its place and no doubt, solder will continue to be used for many years to come in many applications. Still change is the only universal constant and tomorrow will be different from today.

    Thanks again for all of the attention you are giving to Occam, Ron.

    Kind regards,
    Joe

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