Dr. Lasky’s Blog — All about Electronic Assembly Stuff

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• IBM Announces Shipment of Lead-Free C4 Joints

  July 23rd, 2007

  

  

  

  

  

  Folks,

  IBM annoounced production of its totally lead-free “C4” (controlled collapse chip connection) solder joint, C4NP. This announcement strikes a blow to those that thought the RoHS exemption for “high lead” solder joints would last forever. Many thought that C4 technology could never go lead-free. C4 joints are used extensively in flip chip technology.

  Cheers,

  Dr. Ron

  Note: Thanks to Dr. Dan Baldwin for the image!

  Posted July 23rd, 2007 by Dr. Ron Lasky

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