Dr. Lasky’s Blog — All about Electronic Assembly Stuff
Dr. Lasky: a straight shooter, helping you keep your process performance on target.
Folks,
IBM annoounced production of its totally lead-free “C4” (controlled collapse chip connection) solder joint, C4NP. This announcement strikes a blow to those that thought the RoHS exemption for “high lead” solder joints would last forever. Many thought that C4 technology could never go lead-free. C4 joints are used extensively in flip chip technology.
Cheers,
Dr. Ron
Note: Thanks to Dr. Dan Baldwin for the image!
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Mike B:
Is there any durability/reliability data?