Dr. Lasky’s Blog — All about Electronic Assembly Stuff
Dr. Lasky: a straight shooter, helping you keep your process performance on target.
Folks,
My Indium colleagues Dr. Andy Mackie, Jim Hisert and Adrian Low published a nice overview article on Solder Use in Chip Packaging. The article covers topics such as solder types and selection, bumping, soft errors, DCA, solder spheres, soldering with nano particles and much more. Check it out here. It is on page 49-52 in the November-December 2007 issue.
Cheers, and the best in the New Year!
Dr. Ron
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The opinions expressed here are the personal opinions of Dr. Ronald C. Lasky. Content published here is not read or approved by the Indium Corporation and does not necessarily represent the views and opinions of the company. In addition, they are not guaranteed to be correct, complete, or up-to-date. By using this blog site you understand that any information or advice is of a general nature and may not apply to your specific situation. It is the reader’s responsibility to confirm and verify all information prior to implementing any endeavors based on the information. This blog/website should not be used as a substitute for competent personal advice from a trusted professional.
