The IMAPS Device Packaging Conference is quickly approaching, it’s less than a week away! If I had to pick one conference to go to per year, it would be this one.
With up to four presentations going on at any given time, now is a good time to start planning which sessions you want to attend. The conference divides its attention into 5 catagories: 3D packaging, flip chip, biomedical, MEMS, and wafer level / chip scale packaging.
I look forward to seeing you all there.
Posted by Jim Hisert on March 11th, 2008 at 11:21 AM
