Today I was able to attend a professional development course related to Package-on-Package technology and trends. While the session was very informative, it seems that there has been little consideration given to multiple solderpaste/flux suppliers in the generation of data for the course.
In any event, it is nice to see where the industry is headed with this assembly process – and how we can meet technological expectations in the years to come.
Posted by Jim Hisert on March 17th, 2008 at 4:00 PM
