Today I had a chance to catch up with the guys from Sikama at their booth. Pictured here from left to right are: Sigurd Wathne (President and Founder), myself, and Phillip Skeen.
The conduction reflow equipment in the foreground of the picture is what I use to evaluate different flux/alloy/surface finish combinations. Sure it’s not the intended use, but I’ve been using the tabletop unit instead of an old fashioned hotplate because I like the temperature control accuracy. Look forward to the full article on simple test methods in Advanced Packaging this fall.
Posted by Jim Hisert on March 18th, 2008 at 3:32 PM
