Day 3 of the Device Packaging Conference

The third day of the Device Packaging Conference has passed, with some interesting presentations from NXP, Amcor, and Atotech – to name a few. Many of the presentations were focused on comparing new materials to existing Pb-free standards.

Francoise von Trapp (Managing Editor for PennWell) was on hand to represent Advanced Packaging. The Advanced Packaging Editors travel around the globe and try to get to all the major industry events. They even tour material vendor facilities (like Indium’s) to learn more about the industry.

Posted by Jim Hisert on March 24th, 2008 at 10:13 AM

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