We are looking into a way to deposit solder on a typical die attach machine without using die-attach paste – and without a tooling change. This new process will offer the same high conductivity and mechanical strength of a solder joint made with paste, although void levels and issues associated with dispensing paste will be eliminated.
I wish I could say more now, but we need to wait until it is released to fully disclose this revolutionary new process.
Posted by Jim Hisert on March 6th, 2008 at 8:04 AM
