Due to the limitations of flux, there is bottom end temperature where traditional solder/flux bonding ends. The lowest temperature I have experienced is 100 deg C (peak). This was only achieved with a certain flux / alloy / surface finish / temperature / time combination.
If your question is “how low of a temperature can achieve a solder bond”, there you go – kind of… The exception is cold welding at room temperature. This is achieved with pure indium.
Posted by Jim Hisert on April 29th, 2008 at 8:02 AM
