Intermetallic Growth

Time is precious, and some alloys take their precious time to form intermetallics. For lower melting point alloys, quick wetting doesn’t mean an appropriate amount of intermetallics have formed to bond the solder optimally. Time above liquidus may need to be extended as long as 5 minutes to allow very low temperature alloys a chance to dissolve a surface finish and form intermetallics.

Posted by Jim Hisert on May 1st, 2008 at 8:06 AM

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