I recently had a chance to work with Fries Research & Technology (FRT) to measure deposited material volumes and shapes. The guys from FRT were knowledgeable in both their product and industry applications. It only took a few minutes of demonstration to realize there are endless uses for this technology.
The image shown here is a 3D model of the hand-printed material we analyzed. The output was not only visually stunning – it was technically impressive as well. Volume, peak heights, co-planarity, and surface roughness were only a few of the many measurements that were readily available.
Posted by Jim Hisert on March 3rd, 2008 at 8:15 AM
Jeff Schake:
Jim: Nice imagery of the printed flux deposits. I think our industry is somewhat deficient in the knowledge presently available on evaluation of flux deposition processes based on quantitative evaluation of discrete deposits. There is another company I have seen recently advertise flux deposit inspection capability, Cyber Technologies. It will be interesting to see if the industry responds by adopting these “new” tools to provide us greater detail on flux deposition process control.
Jim H.:
Thanks Jeff,
It really is amazing that the semiconductor packaging industry (in general) doesn’t bother to measure flux deposits – yet.