Indium Corporation
Metal Thermal Interface Materials
Search Site

A Great Time at IWLPC 2008

Posted by Jim Hisert

Monday, October 13th, 2008

Okay, so this isn’t what it looks like at the International Wafer Level Packaging Conference (IWLPC) – but it will be an exciting technical event.  One thing that I really appreciate about the IWLPC is that the presentations are always focused and scientific.  Professionals know when they are being sold something, and that is not what we are all there for.  We want to know the facts – without fluff and marketing.  The IWLPC does a great job with this by filtering the submissions and standing up for what they believe in.

Share your thoughts by COMMENTING. Or, email the blogger at jhisert@indium.com.

Posted by Jim Hisert at 8:00 AM (October 13th, 2008)


Tags:

Comments (add your comment)
    There are no comments on this entry yet.
Comment on this entry
optional (will not appear online)
http://yoursite – optional (will appear online)

Important! Please find the letters in the image opposite, then type them into the box above. You are asked to do this in order to verify that this comment is not being submitted by an automated process.

top of page