Awards

Triple Awards for NF260 No-Flow Underfill

Indium Corporation’s introduced the world’s first Pb-Free, Reworkable, Air-Reflowable, No-Flow Underfill, called NF260, in 2005. Since its introduction Indium’s NF260 No-Flow Underfill has won awards on three continents for its quality and innovation, as well as its ability to enhance customers’ finished goods reliability and cost savings.

Europe – Global SMT Technology Award for Innovation was awarded at Productronica (Nuremberg, Germany) in 2005
North America – SMT Vision Award was presented at IPC/APEX (Anaheim, California, USA) in 2006
China – EM China Innovation Award was presented at Nepcon Shanghai (Shanghai, China) in 2006

Frost & Sullivan Award

Indium has earned its fourth Frost & Sullivan Award for SMT Solder Paste Customer Value Enhancement in 2006. 

According to Frost & Sullivan, awards are presented to companies "for exhibiting a superior knowledge of customer needs and the ability to exceed customer expectations." Indium Corporation was chosen to receive the award based on an in-depth analysis of market competitors, and interviews with companies that make up the SMT soldering materials industry.

"These awards are special because they are presented by the largest and most respected research firm in the world," said Rick Short, Director of Corporation Communications. "It is truly a tribute to the global Indium Corporation team."

Previous Frost & Sullivan Awards include: