Amanda Hartnett
Applications Engineer
Indium Corporation
Ph: +1.315.853.4900 x7599
E-mail: ahartnett@indium.com
Address: 34 Robinson Rd, Clinton, NY USA 13323
Blog
Biography
Amanda is a Technical Support Engineer for Indium Corporation, supporting customers throughout the Northeastern United States. She provides technical advice in the selection and application of Indium's full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets. 
Amanda has presented at numerous technical conferences such as IMAPS, SMTA International, and SVC Tech Con, and has authored several technical papers on thermal management and microelectronics packaging materials. She specializes in working with assembly materials for high-power applications which demand thermo-mechanical reliability.
Amanda has a bachelor's degree in Chemistry from Utica College and has earned her Lean Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. She is currently completing her MBA at the State University of New York Institute of Technology.
In her free time, Amanda enjoys the company of her husband, Andrew, their twins, Lottie and Doyle, and their Boston terrier, Hope.
