Amanda Hartnett
Applications Engineer
Indium Corporation
Ph: +1.315.853.4900 x7599
E-mail: ahartnett@indium.com
Address: 34 Robinson Rd, Clinton, NY USA 13323
Blog
Biography
Amanda is an Applications Engineer for Indium Corporation supporting our Engineered Solders customers. She provides comprehensive technical advice in the selection, use, and application of engineered solders and fluxes to customers in electronics assembly, 
optoelectronics, thermal management, semiconductor packaging, and related industries. She has broad experience working with assembly materials for high-power applications which demand thermo-mechanical reliability, as well as the NanoBond® process for component and sputtering target bonding.
Amanda has presented at numerous technical conferences such as IMAPS, SMTAI, and SVC. She has authored several technical papers on thermal management and microelectronics packaging materials.
Amanda has a bachelor’s degree in Chemistry from Utica College and is certified as a Six-Sigma green belt through Dartmouth College’s Thayer School of Engineering. She is currently working on her MBA at the State University of New York Institute of Technology.
In her free time, Amanda enjoys the company of her husband, Andrew, their twins, Lottie and Doyle, and their Boston terrier, Hope.
