Tim Jensen
Product Manger, PCB Assembly Materials
Indium Corporation
Ph: +1.315.853.4900 x7568
E-mail: tjensen@indium.com
Address: 34 Robinson Rd, Clinton, NY USA 13323
Blog
Biography
Tim Jensen is the Product Manager for Indium Corporation’s PCB Assembly Materials and an SMTA-Certified SMT Process Engineer. His product line includes:
- Sn/Pb and Pb-free solder paste
- Halogen-free soldering materials
- Wave solder fluxes
- Bar solder
- Rework fluxes
- Flux-cored wire
Tim has spent over a 12 years working with customers to troubleshooting and optimizing SMT process lines, solving issues such as:
- Head-in-pillow
- Graping
- QFN voiding
- and more
Having worked directly on hundreds of surface mount lines, and building thousands of different products, Tim understands each customer’s unique requirements. Using that direct knowledge and expertise, he works closely with Indium’s technical service, sales, and R&D teams to develop cutting edge products that address the unique challenges faced by the electronics assembly industry.
Tim has a Bachelor’s degree in Chemical Engineering from Clarkson University and a member of the SMTA. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. He has presented at technical conferences both nationally and internationally. Some of his works include:
- Head-in-Pillow: The Defect that Caught Us Napping
- The Graping Phenomenon: Improving Pb-Free Solder Coalescence Through Process and Material Optimization
- Influence of Reflow Profiling and Pb-Free Solder Paste in Minimizing Voids for QFN Assembly
- Stencil Printing and Reflow in Lead-Free Assembly
- Challenges of Implementing a Halogen-Free PCB Assembly Process
- Proliferation of Lead-Free Alloys
