Trade Shows
Indium Corporation participates in more than 50 trade shows worldwide. In addition to major shows, we exhibit at most local SMTA and IMAPS shows.
If you are interested in additional information, or would like to know if the Indium Corporation will be in attendance at a particular show, please e-mail vcruz-griffith@indium.com.
Look for the Indium Corporation at these upcoming trade shows:
SMTA Huntsville
April 16-18, 2013
Huntsville, AL
PCB Assembly Materials, Engineered Solders
Schedule an appointment at the show
SMT Nuremberg
April 16-18, 2013
Nuremberg, Germany
PCB Assembly Materials, Power Electronics
Stand Number 7-430
Presentations:
- Ning-Cheng Lee - Two professional development courses
- Wolfgang Bloching - Miniaturization - Solder Paste Attributes to Maximize the Manufacturing Process Window (technical presentation)
- Karthik - Lead-free SMT Assembly for High Reliability, Yield, and Throughput (tutorial)
SVC TechCon
April 23-24, 2013
Providence, RI
Thin-Film Compounds and Metals
Booth Number 313
Presentations:
- Jim Hisert - Eliminating the Bond Stress of Sputtering Targets at Operational Temperatures (paper presentation)
- Jacques Matteau - High-Temperature, Pb-free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil (paper presentation)
IMAPS NE
May 7, 2013
Boxboro, MA
TBD
Presentations:
- Ron Lasky - poster session chair
- Tim Jensen - Materials and Process Optimization for Head-In-Pillow Minimization (poster), and SACM™ Solder: A High Reliability, Low Cost Alternative to SAC305 (presentation)
- Seth Homer - Minimizing Solder Voiding in QFN Packages Using Solder Preforms (poster)
- Ed Briggs - QFN Voiding (presentation)
SMTA Seattle
May 7, 2013
Seattle, WA
PCB Assembly Materials
Schedule an appointment at the show
SMTA Portland
May 9, 2013
Portland, OR
PCB Assembly Materials
Schedule an appointment at the show
PCIM
May 14-16, 2013
Nuremberg, Germany
High Power Semiconductor Materials
Stand Number 7-454
Presentation:
- Karthik - Power Electronics - Solder TIMs (Thermal Interface Materials) for Superior Thermal Management (presentation)
SMTA Toronto/ICSR
May 14-17, 2013
Toronto, Canada
TBD - PCB Assembly Materials
Schedule an appointment at the show
ESTC
May 21-22, 2013
Las Vegas, NV
SACM
Booth Number 508
Presentations:
- Tim Jensen - Soldering Technology for Electronics Assembly: Achieving High Yields and Reliability (professional development course)
- Brook Sandy-Smith - Proven Strategies to Minimize Voiding under QFNs and other Bottom Termination Components (presentation)
SMTA Space Coast
June 13, 2013
Melbourne, FL
TBD - PCB Assembly Materials
Presentation:
- Ed Briggs - Solder Joint Failure Analysis (panel)
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