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Indium Corporation of America
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View Dr. Lasky’s Latest Webinar “Lead-Free Success Stories”.
SMTe magazine features Indium’s William Aw (on the right) and Rick Short (center), along with Mr. Foo from EM Asia (left). Rick and William are shown accepting the EM Asia Award for Innovation for Indium’s NF260 No-Flow Underfill. This was the third award for this product. NF260 previously won the Global Technology Award at Productronica in November 2005 and the Vision Award at APEX in February 2006, also featured on the cover.
Indium Corporation’s work was covered in two highly-read electronics assembly trade magazines — each as the cover story:
SMT (and SMT China and SMT Germany) features a powerful article by Indium’s Karl Pfluke. It details a manufacturing technique that enables some SMT assemblers to eliminate the costly and sometimes complex Pb-Free wave soldering step. Karl’s Pin-in-Paste Plus (PIP+) process combines proven and dependable techniques to eliminate an entire process step, saving people money while improving quality and costs. An illustrated depiction of the process appears on the cover.
EM China Magazine features our own highly-esteemed Dr. Ning-Cheng Lee on the cover. Inside readers will find an article by Indium’s Tim Jensen. This great article covers solder paste evaluation techniques to simplify the transition to Pb-Free. Tim spearheads Indium’s Pb-Free solder program and has his finger on the pulse of materials, processes, and legislation. Both of these men are great resources.