Indium Corporation®
Select an area to search
  • People
    • Technical Support Engineers
    • Sales
    • Human Resources
      • Jobs
      • Community Support
    • Marketing Communications
      • Trade Shows
      • Company News
      • Corporate Awards
      • Technical Milestones
      • Social Media
    • Employee Biographies
    • Corporate
      • About Us
      • Social Responsibility
      • Company News
      • Corporate Awards
      • ISO and ITAR
      • Trade Shows
      • Corporate Literature
    • Bloggers
    • Social Media
    • Facilities
    • Contact Us
  • Products
    • Flux and Epoxy
      • Ball-Attach Flux
      • Epoxy Flux
      • Flip-Chip Flux
      • Flux Pens
      • Flux-Cored Wire
      • Industrial Flux
      • Liquid Tabbing Flux
      • Package-on-Package Flux
      • Tacky Flux
      • TCB and Copper PIllar Flux
      • Wave Flux
      • Wafer Bumping Flux
    • Inorganic Compounds
      • Featured Products
      • Indium Compounds
      • Gallium Compounds
      • Germanium Compounds
    • Metals
      • Indium
      • Gallium
      • Tin
      • Germanium
      • Reclaim and Recycle
    • NanoFoil®
      • Sheets
      • Preforms
      • Powders and Particles
      • Sputtering Target Bonding
    • Reclaim and Recycle
      • Metals Recycling
      • Solder and Solder Dross Recycle Program
    • Solar Assembly Materials
      • Metallization Paste
      • SUNTAB™ PV Ribbon
      • Liquid Tabbing Flux
      • Solders
    • Solder Paste and Powders
      • SACM™
      • Indium8.9 Series
      • Lead-Free
      • Tin-Lead
      • Package-on-Package Paste
      • Low Temp/High Temp
      • Die-Attach
      • Wafer Bumping Paste
      • Solder Fortification®
      • Gold-Based Solder Paste
    • Solders
      • Bismuth Solders
      • Gold Solders
      • Indium Solders
      • Bar Solder
      • Low Temp/High Temp
      • Preforms
      • Ribbon and Foil
      • Solder Fortification®
      • Solder Paste and Powders
      • Solder Research Kits
      • Spheres
      • Tape and Reel Packaging
      • Wire
      • Alloy Chart
    • Thermal Interface Materials
      • Heat-Spring®
      • NanoFoil®
      • Preforms
      • Ribbon and Foil
      • Other
      • Solder TIM
    • Thin-Film Materials
      • Featured Products
      • Sputtering Targets
      • Indium
      • Gallium
      • Others
  • Applications
    • Compounds
      • Batteries
      • Catalysts
      • Fiber Optics
      • LED MOCVD Precursors
      • Optical Lens
      • Reclaim and Recovery
    • Engineered Solder and Alloys
      • Connector Assembly
      • Cryogenic Seals
      • Die-Attach
      • Hermetic Sealing and Pass Throughs
      • IGBT
      • Medical Devices and Electronics
      • Thermal Management
    • LED
    • Low Temperature Alloys
    • Medical Devices and Electronics
    • PCB Assembly
      • Package-on-Package
      • Rework and Touch-Up
      • Solder Fortification®
      • Surface Mount
      • Thermal Management
      • Wave Solder
    • Semiconductor and Advanced Assembly
      • 2.5 and 3D Packages
      • Ball-Attach
      • Die-Attach
      • Flip-Chip
      • Pb-Free Including High Temperature Pb-Free
      • Shock Resistance Solutions
      • SnPb Including High Temperature High Pb
    • Thermal Management
      • Burn-in and Test
      • Concentrated Photovoltaic
      • IGBT
      • RF Power Devices
      • TIM1, TIM1.5, TIM2
    • Thin-Film
      • Thermal Evaporation
      • Plating
      • PV Sputtering Targets
      • Target Bonding
      • PVD Coating Materials
  • Contact Us

Engineered Solder and Alloys

Home » Applications » Engineered Solder and Alloys

  • Engineered Solder
    and Alloys
  • Related
    Technical Documents
  • Related
    Blog Posts
Engineered Solder and Alloys
  • Connector Assembly
  • Cryogenic Seals
  • Die-Attach
  • Hermetic Sealing and Pass Throughs
  • IGBT
  • Thermal Management
  • Assembly Products for Medical Devices and Electronics
  • Solder Alloy Chart

Top Engineered Solder and Alloy Technical Documents

  • Solder Alloy Chart (Letter)

    Product Data Sheet

Engineered Solder and Alloys Technical Documents

Whitepapers

No whitepapers to display

Application Notes

No application notes to display

Product Data Sheets

Solder Alloy Chart (Letter)

Material Safety Data Sheets

No material safety data sheets to display

Indium Corporation Blog Posts

NanoBond® is a Fluxless Process

Thursday, May 16, 2013 by Jim Hisert [view bio]

Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…

The Right Climate Stuff Research Team Hits the Mark

Tuesday, May 14, 2013 by Dr. Ron Lasky [view bio]

Folks, Many agree that the greatest technical achievement of human kind was landing a man on the moon and returning him safely to earth. (Just think about the fact that all of this was done with less computing power than your smartphone!).  Some of the folks involved in this effort  joined…

High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®

Tuesday, May 14, 2013 by Jim Hisert [view bio]

In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at the show (presented by Jacques Mateau) regarded another very interesting topic. The paper, High Temperature, Pb-Free, Metallic Sputtering Target Bonding…

View All Blog Posts

#
Jordan Ross

This page is owned by:

Jordan Ross
Senior Product Manager, Engineered Solders and Thermal Materials
jross@indium.com

INDIUM CORPORATIONwww.indium.comaskus@indium.comPRC +86 (0)512 628 34900SINGAPORE +65 6 268 8678UK +44 (0) 1908 580400USA +1 315 853 4900

From One Engineer to Another®

Indium Corporation — ©1996–2013. All Rights Reserved. | Site Map

Related to Engineered Solder and Alloys

  • Solder Alloy Chart
  • Assembly Products for Medical Devices and Electronics

Material Safety Data Sheets
Product Data Sheets
ISO and ITAR
Online Store
Tech Team

Connect with Indium

  • LinkedIn
  • Facebook
  • Twitter
  • YouTube
  • Blogger

+ Read our latest posts!

Americas

Utica, Chicago, Clinton
E-Mail: askus@indium.com
Phone: +1 315 853 4900

Asia/Pacific

Singapore, Cheongju
E-Mail: asiapac@indium.com
Phone: +65 6268 8678

China (中国网站)

Suzhou, Shenzhen, Liuzhou
E-Mail: china@indium.com
Phone: +86 (0)512 628 34900

Europe

Milton Keynes, Torino
E-Mail: europe@indium.com
Phone: +44 (0)1908 580400

Regional/Local Sales Support
Technical Service & Support

  • Home
  • Online Store
  • ISO and ITAR
  • Corporate
  • Tech Documents
  • MSDS
  • About Us
  • Jobs