Implementation of 5G is happening fast and design criteria are dynamic! Indium Corporation supplies a full line of products that enable superior reliability and performance for all your packaging needs.
LV1000 Flux Coating for Solder Preforms
- Minimal flux residue
- No electrochemical migration (ECM) impact
- Improves bondline planarity
- Increases joint strength
- No ECM Issues
5G Technical Documents
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Safety Data Sheets
5G Blog Posts
Indium Corporation presents paper at Advanced Technology Workshop that provdes metal thermal interface materials (TIMs) have a higher insertion rate and higher thermal conductivity than traditional TIMs for burn-in and test.
Folks, the adventures of The Professor continue. This blog post is a must-read if you are concerned about improving electronics assembly line productivity and uptime.
Having samples of different alloys can be very useful for R&D departments. Fortunately, Indium Corporation offers solder research kits so you can test various alloys with your assembly process to find just the right match.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.