Die-Attach
Precise application and positioning; precise chemistry; precise dimensional tolerances, dimensions, and shape are all critical parameters for a successful die-attach or thermo-electric cooler assembly process. Indium Corporation’s precise and consistent products are supplied to numerous world-class facilities around the globe and are backed by Indium’s world renown quality and technical support engineering expertise.
Indium Corporation’s internationally experienced engineers provide in-depth technical assistance to our customers. Contact them for:
- Alloy selection from our list of over 220 solders
- Physical, mechanical and fatigue life properties of solder
- Substrate metallization and alloy compatibility
- Solder preforms, wire, ribbon, and paste selection for bonding
Die-Attach Technical Documents
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Die-Attach Blog Posts
The Magic of Engineered Solders
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…
Heat Dissipation During a NanoBond® Reaction
One of the best parts of using NanoFoil® to create a bond with dissimilar metals or heat sensitive components is that the heat it creates is quickly dissipated before it can heat up areas outside of the bondline. In the pictures above (taken before, during, and after a NanoBond®), you…
No-Clean Solder Paste for Clip-bonding Die-Attach
I’m just back from Malaysia, where I visited one of our larger customers who has been using our high-lead (high-Pb) dispensable NC-SMQ75 solder paste for many years. No surprises there, but what many people don’t realize is that the NC-SMQ75 solder paste can be used as a…
This page is owned by:
Jordan Ross
Senior Product Manager, Engineered Solders and Thermal Materials
jross@indium.com
From One Engineer to Another®
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