Precise application and positioning; precise chemistry; precise dimensional tolerances, dimensions, and shape are all critical parameters for a successful die-attach or thermo-electric cooler assembly process. Indium Corporation’s precise and consistent products are supplied to numerous world-class facilities around the globe and are backed by Indium’s world renown quality and technical support engineering expertise.
Indium Corporation’s internationally experienced engineers provide in-depth technical assistance to our customers. Contact them for:
- Alloy selection from our list of over 220 solders
- Physical, mechanical and fatigue life properties of solder
- Substrate metallization and alloy compatibility
- Solder preforms, wire, ribbon, and paste selection for bonding
Die-Attach Technical Documents
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Die-Attach Blog Posts
As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use solder at the die-attach, DBC Substrate, and Baseplate level, we can achieve a more reliable IGBT that can form at increasingly higher standards. If you missed that video, be sure to check it out at www.indium.com/IGBT.
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high melting s...
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up.
From One Engineer to Another®
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