Precise application and positioning; precise chemistry; precise dimensional tolerances, dimensions, and shape are all critical parameters for a successful die-attach or thermo-electric cooler assembly process. Indium Corporation’s precise and consistent products are supplied to numerous world-class facilities around the globe and are backed by Indium’s world renown quality and technical support engineering expertise.
Indium Corporation’s internationally experienced engineers provide in-depth technical assistance to our customers. Contact them for:
- Alloy selection from our list of over 220 solders
- Physical, mechanical and fatigue life properties of solder
- Substrate metallization and alloy compatibility
- Solder preforms, wire, ribbon, and paste selection for bonding
Die-Attach Technical Documents
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Product Data Sheets
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Safety Data Sheets
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Die-Attach Blog Posts
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up.
There exists a wide range of assembly products for the SiP process, especially solder pastes.
Product Manager for Engineered Solders Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.