Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both clean up the solder joints before reflow, and to reinforce the final joint from the cured polymer.
Related Markets and Applications
PK-005 Flip-Chip Epoxy Flux (Letter)
Product Data Sheet
Storage and Handling of Specialty Fluxes (Letter)
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Solder Bumping Via Paste Reflow For Area Array Packages (Paper)
Epoxy Flux Blog Posts
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending both as as an exhibitor and as a session co-chair. TECHNICAL SESSION: This year there will be 6 technical tracks: Interposers & 2.5/3D Packaging Modeling,…
I’m just back from Malaysia, where I visited one of our larger customers who has been using our high-lead (high-Pb) dispensable NC-SMQ75 solder paste for many years. No surprises there, but what many people don’t realize is that the NC-SMQ75 solder paste can be used as a no-clean material in…
Many, many thanks to the hundreds of you who came by the Indium Corporation booth at Semicon West this year. Some of you came to hear about our recent global Semiconductor Assembly Materials Roadmap presentations, and all of you wanted to talk about your specific materials needs.…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.