Epoxy Flux
Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both clean up the solder joints before reflow, and to reinforce the final joint from the cured polymer.
Related Markets and Applications
Critical Products
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Technical Paper
Interconnections for SMT, BGA, and Flip Chip Technologies (Paper)
Technical Paper
Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects (Paper)
Technical Paper
PK-005 Flip-Chip Epoxy Flux (Letter)
Product Data Sheet
MSDS
Epoxy Flux Blog Posts
No-Clean Solder Paste for Clip-bonding Die-Attach
I’m just back from Malaysia, where I visited one of our larger customers who has been using our high-lead (high-Pb) dispensable NC-SMQ75 solder paste for many years. No surprises there, but what many people don’t realize is that the NC-SMQ75 solder paste can be used as a…
Indium Corporation at Semicon West 2011
Many, many thanks to the hundreds of you who came by the Indium Corporation booth at Semicon West this year. Some of you came to hear about our recent global Semiconductor Assembly Materials Roadmap presentations, and all of you wanted to talk about your specific materials needs.…
Solder Metal Prices Skyrocket, Especially Silver
Folks,Many people have been infatuated by the price of gold in recent months, but the price of silver has also skyrocketed. In 2000 silver was about $3.00 per troy oz. In the eight years that followed, its price grew to $15/oz. Today it is trading at over $41/oz! This price is almost…
This page is owned by:
Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
amackie@indium.com
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