Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both clean up the solder joints before reflow, and to reinforce the final joint from the cured polymer.
Epoxy Flux Blog Posts
Epoxy Flux Rework and Clean-up
The dipping process is a convenient process to use for the application of Epoxy Flux because most pick and place equipment already have dipping units installed and there is no need for extra equipment or the costs associated with it. However, unless you have more than one dipping unit in...
Applying Epoxy Flux using a dipping process
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
PCBA New Product Development Manager
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.