Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA ball-attach, preform soldering, and virtually any application where a flux is required. Cycle times are not critical as TACFlux® may sit for hours with no reflow degradation.
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Not all fluxes can handle the high processing temperature required for Au/Sn solder preforms.
Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms - I'll tell you how.
Au/Sn is available in all the forms you would expect from conventional solder alloys.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.