Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA ball-attach, preform soldering, and virtually any application where a flux is required. Cycle times are not critical as TACFlux® may sit for hours with no reflow degradation.
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Tacky Flux Technical Documents
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Product Data Sheets
Safety Data Sheets
Flux Blog Posts
Currently, for the ball-attach process, customers are facing issues like warpage of the substrates...
Voiding in flux-cored wire causes serious problems. Learn about the causes of voiding and a way to Avoid The Void™
This video is for anyone interested in the flux challenges associated with flip-chip/BGA balling. Keywords: Phil Zarrow, Andy Mackie, Indium Corporation, amac...
Director of Business Development and Printed Circuit Board Assembly
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.