Tacky Flux
Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA ball-attach, preform soldering, and virtually any application where a flux is required. Cycle times are not critical as TACFlux® may sit for hours with no reflow degradation.
Tacky Flux Technical Documents
Whitepapers
Application Notes
Product Data Sheets
Material Safety Data Sheets
Flux Blog Posts
Reflow of Copper Pillar Microbumps
Waferbumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste printing (with all its concerns of voiding, coplanarity, stencil-life, and spatter) to plated solderbumps, and now to plated copper pillars with microbumps…
NanoBond® is a Fluxless Process
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…
The Magic of Engineered Solders
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…
This page is owned by:
Eric Slezak
Director of Business Development and Printed Circuit Board Assembly
eslezak@indium.com
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