Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA ball-attach, preform soldering, and virtually any application where a flux is required. Cycle times are not critical as TACFlux® may sit for hours with no reflow degradation.
Tacky Flux Technical Documents
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Flux Blog Posts
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble vs. no-clean, also plays a significant role. Solder pastes are sensitive to the environment to which…
At APEX 2014, I presented a paper about the effect that reflow profiling has on the SIR (Surface Insulation Resistance) performance (electrical reliability) of no-clean solder paste flux residues. In this study, I looked at two different SAC305 no-clean solder pastes; one with a J-STD-004B classification…
SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the stencil printer. Figure 1 (below) depicts a very busy Ishikawa diagram illustrating why this is the case. There is simply a wide variety of variables that…
Director of Business Development and Printed Circuit Board Assembly
From One Engineer to Another®
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