TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar applications. Its rheology and chemical design enables its use with dipping depths down to 10 microns or less.
The amount of flux deposited on the substrate can be optimized by changing equipment parameters. Key variables include temperature, copper-pillar dimensions, shear speed, time of shearing before dipping, dwell time in flux, and depth of immersion. The flux rheology can be optimized for the desired application by shearing to achieve the desired viscosity.
Packaging is available in 10cc and 30cc syringes.
Related Markets and Applications
Top TCB and Copper Pillar Flux Documents
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Product Data Sheet
Interconnections for SMT, BGA, and Flip Chip Technologies (Paper)
Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects (Paper)
TCB and Copper PIllar Flux Technical Documents
Safety Data Sheets
Flux Blog Posts
I just can’t get enough of a good thing. My last post mentioned donuts – one of my favorite treats. Allow me to continue reveling in the chewy sweet delight. On Saturdays the kids like to be taken for donuts; it usually doesn’t take much convincing. But, it’s not…
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the final ball-attachment from the number of assembly processes needed before. These processes can be…
While in South East Asia last summer, Indium's technical team and I had a chance to discuss flip-chip dipping processes with a major equipment vendor. One of the topics was device (bumped package or die) "pick-up" out of a flip-chip flux dipping tray, and how different factors affect…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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