TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar applications. Its rheology and chemical design enables its use with dipping depths down to 10 microns or less.
The amount of flux deposited on the substrate can be optimized by changing equipment parameters. Key variables include temperature, copper-pillar dimensions, shear speed, time of shearing before dipping, dwell time in flux, and depth of immersion. The flux rheology can be optimized for the desired application by shearing to achieve the desired viscosity.
Packaging is available in 10cc and 30cc syringes.
Related Markets and Applications
Top TCB and Copper Pillar Flux Documents
Product Data Sheet
Storage and Handling of Specialty Fluxes (Letter)
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Interconnections for SMT, BGA, and Flip Chip Technologies (Paper)
TCB and Copper PIllar Flux Technical Documents
Safety Data Sheets
Flux Blog Posts
Lamp style preheaters have the fastest response time of any of the previous preheaters mentioned in other posts. The lamp filament is practically the sole thermal mass; it is so fast that the response time is measured in seconds rather than minutes, as with the other models. This type of…
Finally – the fun part! After all of your work specifying the right materials and applying them, at last we can test all of the assumptions we have made, and the effects of our assembly process. There are many criteria you can test, depending on a specific application, but, in general, you will…
Just as with cutting solder preforms, there are many different ways to apply flux to solder preforms. At your facility you might use a liquid or tacky flux along with bare solder preforms. (Why flux is used is described here) At Indium, we can pre-apply flux to your solder preforms, and we can make the…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.