TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar applications. Its rheology and chemical design enables its use with dipping depths down to 10 microns or less.
The amount of flux deposited on the substrate can be optimized by changing equipment parameters. Key variables include temperature, copper-pillar dimensions, shear speed, time of shearing before dipping, dwell time in flux, and depth of immersion. The flux rheology can be optimized for the desired application by shearing to achieve the desired viscosity.
Packaging is available in 10cc and 30cc syringes.
Related Markets and Applications
Top TCB and Copper Pillar Flux Documents
Product Data Sheet
Storage and Handling of Specialty Fluxes (Letter)
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Solder Bumping Via Paste Reflow For Area Array Packages (Paper)
TCB and Copper PIllar Flux Technical Documents
Safety Data Sheets
Flux Blog Posts
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT optimization using ultrafine solder paste pulls together everything we have discussed previously as…
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Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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