TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar applications. Its rheology and chemical design enables its use with dipping depths down to 10 microns or less.
The amount of flux deposited on the substrate can be optimized by changing equipment parameters. Key variables include temperature, copper-pillar dimensions, shear speed, time of shearing before dipping, dwell time in flux, and depth of immersion. The flux rheology can be optimized for the desired application by shearing to achieve the desired viscosity.
Packaging is available in 10cc and 30cc syringes.
Related Markets and Applications
Top TCB and Copper Pillar Flux Documents
Product Data Sheet
Storage and Handling of Specialty Fluxes (Letter)
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Solder Bumping Via Paste Reflow For Area Array Packages (Paper)
TCB and Copper PIllar Flux Technical Documents
Safety Data Sheets
Flux Blog Posts
For this week’s World of Solder Preforms series installment, Brandon Judd explains the importance of reflow profiling: Solder preforms are a very common method of reducing voiding in a soldered device with larger X/Y dimensions. Compared to solder paste (which is approximately 50% flux by…
It sounds bad for me to say this, but I have a lot of SMT magazines cross my desk and, honestly, the solder paste articles rarely draw my interest. I work in a world of solder preforms and that’s really where my mind is at, currently. A recent exception is a paper written by Eric Bastow (Assistant…
Many of my posts have been discussing the different types of wave soldering fluxers: their capabilities and their shortcomings. This section will be similar, except preheaters will be discussed. But first, a quick introduction. The…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.