TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar applications. Its rheology and chemical design enables its use with dipping depths down to 10 microns or less.
The amount of flux deposited on the substrate can be optimized by changing equipment parameters. Key variables include temperature, copper-pillar dimensions, shear speed, time of shearing before dipping, dwell time in flux, and depth of immersion. The flux rheology can be optimized for the desired application by shearing to achieve the desired viscosity.
Packaging is available in 10cc and 30cc syringes.
Related Markets and Applications
Top TCB and Copper Pillar Flux Documents
Cu-Pillar Flip-Chip Flux WS-641 (US Letter)
Product Data Sheet
Cu-Pillar Flip-Chip Flux WS-641 A4 (A4)
Product Data Sheet
Storage and Handling of Specialty Fluxes (US Letter)
Soldering Technology for Area Array Packages (Paper)
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Flux Blog Posts
All rosins are resins, but not all resins are rosins. We owe the fact that we classify fluxes as rosin to pine tree sap having fluxing properties while still being a dielectric and water-insoluble.
One of the key components of the soldering process is the flux. Without the right flux to remove the oxides, then you can end up with a poor solder joint. Since our customers work with a wide range of metallizations, we have a wide range of fluxes.
The Indium Corporation has many summer interns this year. The technical support group was fortunate enough to hire Sarah Bjornland (pictured). She is a very bright student from the a...
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.