TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar applications. Its rheology and chemical design enables its use with dipping depths down to 10 microns or less.
The amount of flux deposited on the substrate can be optimized by changing equipment parameters. Key variables include temperature, copper-pillar dimensions, shear speed, time of shearing before dipping, dwell time in flux, and depth of immersion. The flux rheology can be optimized for the desired application by shearing to achieve the desired viscosity.
Packaging is available in 10cc and 30cc syringes.
Related Markets and Applications
Top TCB and Copper Pillar Flux Documents
Cu-Pillar Flip-Chip Flux WS-641 (US Letter)
Product Data Sheet
Cu-Pillar Flip-Chip Flux WS-641 (A4)
Product Data Sheet
Storage and Handling of Specialty Fluxes (US Letter)
Soldering Technology for Area Array Packages (Paper)
Solder Bumping Via Paste Reflow For Area Array Packages (Paper)
TCB and Copper PIllar Flux Technical Documents
No presentations to display
Safety Data Sheets
No safety data sheets to display
Flux Blog Posts
Trying to select and develop the proper reflow profile? This video explores the differences between the three main profile types.
Surface Insulation Resistance (SIR) tests measure the post soldering effect on the electrical integrity of the circuit boards. This post explores the SIR data that proves that Indium Corporation’s Project 99 wave solder fluxes produce the solder reliability that you need.
The proof is in the data: Indium Corporation’s Project 99 wave fluxes have passed the latest test standards, J-STD-004B, are known to have the latest technology, and are considered the safest available for electronic circuit integrity.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.