TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar applications. Its rheology and chemical design enables its use with dipping depths down to 10 microns or less.
The amount of flux deposited on the substrate can be optimized by changing equipment parameters. Key variables include temperature, copper-pillar dimensions, shear speed, time of shearing before dipping, dwell time in flux, and depth of immersion. The flux rheology can be optimized for the desired application by shearing to achieve the desired viscosity.
Packaging is available in 10cc and 30cc syringes.
Related Markets and Applications
Top TCB and Copper Pillar Flux Documents
Cu-Pillar Flip-Chip Flux WS-641 (US Letter)
Product Data Sheet
Cu-Pillar Flip-Chip Flux WS-641 (A4)
Product Data Sheet
Storage and Handling of Specialty Fluxes (US Letter)
Soldering Technology for Area Array Packages (Paper)
Solder Bumping Via Paste Reflow For Area Array Packages (Paper)
TCB and Copper PIllar Flux Technical Documents
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Safety Data Sheets
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Flux Blog Posts
Voiding in flux-cored wire causes serious problems. Learn about the causes of voiding and a way to Avoid The Void™
This video is for anyone interested in the flux challenges associated with flip-chip/BGA balling. Keywords: Phil Zarrow, Andy Mackie, Indium Corporation, amac...
This video is for anyone interested in flip-chip/BGA balling using the one-step assembly process. Keywords: Phil Zarrow, Andy Mackie, firstname.lastname@example.org, solderi...
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.