TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar applications. Its rheology and chemical design enables its use with dipping depths down to 10 microns or less.
The amount of flux deposited on the substrate can be optimized by changing equipment parameters. Key variables include temperature, copper-pillar dimensions, shear speed, time of shearing before dipping, dwell time in flux, and depth of immersion. The flux rheology can be optimized for the desired application by shearing to achieve the desired viscosity.
Packaging is available in 10cc and 30cc syringes.
Related Markets and Applications
Top TCB and Copper Pillar Flux Documents
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Product Data Sheet
Interconnections for SMT, BGA, and Flip Chip Technologies (Paper)
Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects (Paper)
TCB and Copper PIllar Flux Technical Documents
Safety Data Sheets
Flux Blog Posts
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble vs. no-clean, also plays a significant role. Solder pastes are sensitive to the environment to which…
At APEX 2014, I presented a paper about the effect that reflow profiling has on the SIR (Surface Insulation Resistance) performance (electrical reliability) of no-clean solder paste flux residues. In this study, I looked at two different SAC305 no-clean solder pastes; one with a J-STD-004B classification…
SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the stencil printer. Figure 1 (below) depicts a very busy Ishikawa diagram illustrating why this is the case. There is simply a wide variety of variables that…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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