TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar applications. Its rheology and chemical design enables its use with dipping depths down to 10 microns or less.
The amount of flux deposited on the substrate can be optimized by changing equipment parameters. Key variables include temperature, copper-pillar dimensions, shear speed, time of shearing before dipping, dwell time in flux, and depth of immersion. The flux rheology can be optimized for the desired application by shearing to achieve the desired viscosity.
Packaging is available in 10cc and 30cc syringes.
Related Markets and Applications
Top TCB and Copper Pillar Flux Documents
Product Data Sheet
Storage and Handling of Specialty Fluxes (Letter)
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Solder Bumping Via Paste Reflow For Area Array Packages (Paper)
TCB and Copper PIllar Flux Technical Documents
Safety Data Sheets
Flux Blog Posts
When the wave soldering machine was developed, the early flux application method was the same as the solder application method - a wave. While this technique is not common these days, it still finds some use. So, let's discuss it. First, how it works: The mechanism consists of a container,…
Previously we discussed the importance of dimensions and tolerances in the specification of solder preforms, however these data points are best expressed in the form of an engineering drawing. You may be thinking, “Why would I make a drawing for a rectangle?”. Even if you are specifying a…
A wave solder machine's foam fluxer is a device in which compressed air is fed through a porous tube (commonly referred to as a "stone" because this part used to be made out of unglazed porcelain) that is submerged in foaming flux. The stone is covered with a chimney which helps produce…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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