|Used In High Volume Manufacturing?||Yes||Yes||Yes||Yes|
|Alloy Restrictions||All solder alloys, as long as powder can be made||Binary alloys only (Sn/Pb, Sn/Ag, Sn/Cu etc.) due to alloy control issues||All solder alloys, as long as sphere can be made||Probably limited to binary alloys|
|Bump Size||Down to around 125micron pitch only. Only 45% of paste volume is metal||Down to 2micron bumps feasible: possibly less||60micron bump diameter in mass production, but most commonly used for wafer level CSP manufacturing||Unknown|
|Bump Uniformity||OK: can vary significantly with age of solder paste and print process variables||Good||Good with appropriate tight tolerance solderspheres||Good|
|Voiding||Common||Little or no with a controlled plating process||Little or no||Little or no|
|Cost Comparison||Low Cost||More Expensive||Low Cost||High Capital Cost|
Wafer Bumping Flux Technical Documents
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Safety Data Sheets
Solder Bumping Blog Posts
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some exciting work using InFORM® technology to make more reliable solder joints at a lower...
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the final ball-attachment...
While in South East Asia last summer, Indium’s technical team and I had a chance to discuss flip-chip dipping processes with a major equipment vendor. One of the topics was device (bumped package or die) “pick-up” out of a flip-chip flux dipping tray, and how different factors affect whether...
From One Engineer to Another®
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