The main advantage of alcohol-based fluxes is that they require less preheat to drive off the solvent prior to entering the wave. This allows assemblers to run smaller wave soldering machines at a higher throughput rate. It also reduces the concern about flux that has not been completely heated inadvertently transferring to the top side of the circuit board.
Fluxes that have high solids content, as well as higher amounts of halogen, tend to be more heat-stable and solder better with a variety of board types, sizes, and thicknesses. Fluxes with lower solids contents and no rosin tend to be easier to electronically probe-test and have less visually apparent residue. Halogen content is not necessarily an indicator of final circuit board reliability since halogen types vary and rosin in the flux will enhance an assembly's surface insulation resistance.
|Formula||Acid #||Solids %||S.G.
|3541||25||4.3||0.800||ORL0||ORL1||< 0.5%||Spray||16-3000||No-Clean, Resin Containing, Conformal Coat Comp|
|3590-T||16||1.9||0.801||ORL0||ORL0||< 50 ppm||Spray||16-3000||Halogen Free, Very Low Solids|
|3592||22||3.0||0.820||ORL0||ORL1||< 0.2%||Spray||16-3000||Rosin/Resin Free Low Solids|
|NR10D||12||1.5||0.791||ORL0||ORL0||< 50ppm||Spray||16-3000||Rosin/Resin Free Very Low Solids|
|WF-9940||18||3.6||0.795||ROL0||ROL1||< 0.9%||Spray||16-3000||Rosin Containing, Heat Stable, High activity|
|WF-9942||36||4.4||0.828||ORL0||ORL1||< 0.3%||Spray||16-3000||Low Rosin/Resin, Heat Stable, High activity|
|WF-9945||12.3||5.6||0.802||ROL0||ROL0||< 50 ppm||Spray||16-3000||Rosin, Heat Stable, Halogen Free, high reliability|
|WF-9948||13.4||3.3||0.792||ROL0||ROL1||< 900 ppm||Spray||16-3000||Lower Residue version of WF9940, improved PTH fill|
Fluxes are available in 1-gallon and 5-gallon containers, and 55-gallon drums.
Related Markets and Applications
Alcohol-Based Flux Technical Documents
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Product Data Sheets
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Flux Blog Posts
Not all fluxes can handle the high processing temperature required for Au/Sn solder preforms.
Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms - I'll tell you how.
Au/Sn is available in all the forms you would expect from conventional solder alloys.
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