The original fluxes for electronics assembly were rosin-based. Prior to the IPC's J-STD-004(b), the defense electronics industry established specifications for fluxes. To this day, some contracts still exist that require fluxes that conform to the old Mil-Spec Mil-F-14256 or QQ-S-571 as a type R, RMA, or RA, even though these specifications have officially been folded into the J-Standard. Rosin-based fluxes were popular because not only is rosin a natural weak flux when molten, but it is also a good dielectric material when solid. Small amounts of residue left on the assembly generally will not harm the assembly unless it operates at high temperature and humidity.
|Formula||Acid #||Solids %||S.G.
|2036||50||35%||0.869||ROL0||ROL0||< 50 ppm||Foam||16-3000||Rosin Type "R", ROL0|
|836||50||36%||0.869||ROM1||ROM1||< 0.7%||Foam||16-784||Rosin Type "RA", ROM1|
|2212||38||25%||0.859||ROL1||ROL1||< 0.15%||Foam||16-2212||Rosin Type "RMA", ROL1|
Fluxes are available in 1-gallon and 5-gallon containers, and 55-gallon drums.
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Flux Blog Posts
Not all fluxes can handle the high processing temperature required for Au/Sn solder preforms.
Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms - I'll tell you how.
Au/Sn is available in all the forms you would expect from conventional solder alloys.
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