Gestion thermique
TIM1, TIM1.5 et TIM2
Metal-based thermal interface material (TIM) solutions provide superior thermal performance and long-term reliability across multiple layers of the thermal stack. Whether using air cooling, direct liquid cooling, or immersion cooling, these TIMs can be tailored to meet specific thermal demands. Their ability to wet to a wide range of surfaces, combined with high isotropic thermal conductivity and low yield and flow strengths, allows them to conform to surface irregularities, effectively reducing overall thermal resistance (Rth).
Vue d'ensemble
Spécialisation dans les MIT à base de métal offrant des avantages sur le plan de la thermique, de la fiabilité et de la conformité
Indium Corporation leads the way in developing novel TIMs and processes for TIM1, TIM1.5, and TIM2 applications.
TIM1
Solders and liquid metals are used as high-performance TIMs between a semiconductor die and a package lid. Reflow and non-reflow solutions are available for LGA, PGA and BGA packages that see single or multiple reflow cycles.
TIM1.5
High-performance computing (HPC) applications require best-in-class TIM materials and process expertise. TIM1.5 (bare die lidless BGA packages) is the interface between a bare die and a heat-sink or cold plate and is often used in HPC design. Indium Corporation can help you choose between soldered, compressible, or liquid metal-based TIMs.
TIM2
TIM2 is the interface between a heat spreader or lid and a heat-sink. We typically recommend compressible TIMs, such as Heat-Spring®.
TIM1, TIM1.5, & TIM2 Products
MIT de soudure
Solder TIM solutions offer superior reliability and…
MIT compressibles
Compressible TIMs for top thermal performance and…
Métal liquide et pâte de métal liquide
Liquid metals that are RoHS-compliant and non-toxic.
Métal à changement de phase TIMs
Discover the advantages of PCMA TIMs over…
Applications connexes
Emballage et assemblage de semi-conducteurs
Critical semiconductor packaging ensures functionality and durability.
Refroidissement par immersion
A technique on the rise for thermal…
SiP and Heterogeneous Integration Assembly (HIA)
Système en boîtier (SiP) et solutions d'intégration hétérogène
Gestion thermique
Thermal solutions for HPC ensuring reliability and…
Emballage et assemblage de l'électronique de puissance
Extensive range of proven high-reliability solder and…
Marchés connexes
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