Featured Product

Indium8.9HF Pb-Free, Halogen-Free, No-Clean, Solder Paste

For Halogen-Free inquiries, contact Tim Jensen

Key Features of Indium8.9HF

  • Halogen-Free as flux and residue - view test report
  • Excelling Print Transfer efficiency and RtP
  • No Head-in-Pillow
  • No Slump

Documents

New Technical Paper

The Challenges of Implementing a Halogen-Free Electronics Assembly Process

Debuted at APEX 2009 in Las Vegas, NV, USA on 02 April 2009.

Click Here to Download the Tech Paper

Industry News courtesy of emsnow.com

Consumers boost spending on hot electronics in 2009
Mar 19, 2010 - Despite an unprecedented decline in global per capita income in 2009, global revenue for hot electronic products increased for the year, reflecting a fundamental shift in how consumers are prioritizing their spending, according to iSuppli Corp.
North American Semiconductor Equipment Industry posts Feb '10 Book-to-Bill Ratio of 1.22
Mar 19, 2010 - North America-based manufacturers of semiconductor equipment posted $1.23 billion in orders in February 2010 and a book-to-bill ratio of 1.22, according to the February 2010 Book-to-Bill Report published today by SEMI.
Asia-Pacific Semiconductor suppliers defy the downturn in 2009
Mar 18, 2010 - The global semiconductor industry suffered a sharp downturn in 2009 - but no one bothered to tell the Asia-Pacific-based chipmakers.
High-Tech Product Equipment Orders Inundating Taiwan's Suppliers
Mar 18, 2010 - Taiwan's equipment suppliers have landed orders that are deluging their production lines from high-tech manufacturers thanks to market recovery.

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