Featured Product
Indium8.9HF Pb-Free, Halogen-Free, No-Clean, Solder Paste
Key Features of Indium8.9HF
- Halogen-Free as flux and residue - view test report
- Excelling Print Transfer efficiency and RtP
- No Head-in-Pillow
- No Slump
Documents
Electronics Assembly Blog Links
New Technical Paper
The Challenges of Implementing a Halogen-Free Electronics Assembly Process
Debuted at APEX 2009 in Las Vegas, NV, USA on 02 April 2009.
Click Here to Download the Tech Paper
- Consumers boost spending on hot electronics in 2009
- Mar 19, 2010 - Despite an unprecedented decline in global per capita income in 2009, global revenue for hot electronic products increased for the year, reflecting a fundamental shift in how consumers are prioritizing their spending, according to iSuppli Corp.
- North American Semiconductor Equipment Industry posts Feb '10 Book-to-Bill Ratio of 1.22
- Mar 19, 2010 - North America-based manufacturers of semiconductor equipment posted $1.23 billion in orders in February 2010 and a book-to-bill ratio of 1.22, according to the February 2010 Book-to-Bill Report published today by SEMI.
- Asia-Pacific Semiconductor suppliers defy the downturn in 2009
- Mar 18, 2010 - The global semiconductor industry suffered a sharp downturn in 2009 - but no one bothered to tell the Asia-Pacific-based chipmakers.
- High-Tech Product Equipment Orders Inundating Taiwan's Suppliers
- Mar 18, 2010 - Taiwan's equipment suppliers have landed orders that are deluging their production lines from high-tech manufacturers thanks to market recovery.
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