Indium5.1AT is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this paste offers superb wetting to Pb-Free metallizations and low voiding on CSP’s with microvia-in-pad designs.

Features

  • Ultra-low voiding in BGA/CSP components
  • Ultra-low voiding at via-in-pad sites
  • Excellent micro BGA/CSP printability
  • Wide reflow process window
  • Good response-to-pause performance

Process Window: Indium5.1AT has an extremely robust process window, which has achieved voiding in the sub-5% range over many different profiles.

Response-to-Pause: Indium5.1AT exhibits good response-to-pause. When benchmarked against several industry-leading solder pastes known for low-voiding, Indium5.1AT outperformed them all.

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