Low Temperature Metallization Paste
Also referred to as "grid ink", "silver ink", and "conductive ink", low-temperature metallization paste is a silver-filled contact material for solar cells. It gets is low-temperature label because it is processed at lower-than-traditional glass frit temperatures of ~1,000°C.
In addition to its role as a contact for thin-film connections, low-temperature metallization paste is also useful as a low-temperature alternative metallization on Si-based cells. Combined with Indium Corporation's low-temperature tabbing ribbon and low-temperature tabbing flux, you get the ultimate in low temperature Si cell assembly.
Designed by Award-Winning
Chemists
Indium Corporation's low temperature metallization paste, LTTF-7888 is designed by the same award-winning chemists who also developed the industry-leading printing solder pastes and conductive epoxies for the SMT and semiconductor industries.
Testing Methods
Indium Corporation's Research & Development team has also led the industry in test methods for evaluating low-temperature metallizations.When tested against the leading commercial metallization pastes, LTTF-7888 performed better in bulk resistance and contact resistance.
You can learn more about these testing methods by reading: Test Methods for Measuring Volume Resistivity and Contact Resistance for Metallization Paste.
Contact Us
For more information about Indium Corporation's LTTF-7888 Low Temperature Metallization Paste, tabbing ribbon or flux, contact us at solar@indium.com or visit our metallization paste blog at: http://blogs.indium.com/blog/metallization-paste.
