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Tin

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Tin
  • Indium
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  • Germanium
Tin (Sn)

Tin is primarily obtained from the mineral cassiterite (SnO2).

Top Tin Technical Documents

  • Commercial Tin Metal (Letter)

    Product Data Sheet

  • Indalloy® 128 (Tin)

    MSDS

  • Indalloy® Containing Indium with Tin, Lead, Silver, Copper

    MSDS

  • Indalloy® Indium with Tin, Lead or Silver

    MSDS

  • Indalloy® Tin and Lead Only

    MSDS

Tin Metal Technical Documents

Whitepapers

Request This Document

Sustainability of Indium and Gallium Supplies in the Face of Emerging Markets

Authors: Claire Mikolajczak, Michael D Murphy

Posted on 19 Apr 2011

Request This Document

The Long-Term Supply of Indium and Gallium

Authors: Claire Mikolajczak, Greg Phipps, Terry Guckes

Posted on 10 Mar 2010

Application Notes

No application notes to display

Product Data Sheets

Commercial Tin Metal (Letter)

Material Safety Data Sheets

Indalloy® 128 (Tin)
Indalloy® Indium with Tin, Lead or Silver
Indalloy® with Lead and/or Tin and/or Silver and Antimony
Tin Double Clad Alloy with Silver
Indalloy® Containing Indium with Tin, Lead, Silver, Copper
Indalloy® Tin and Lead Only
Indium Mixed with Metal Alloys (Lead-Free)
Tin-Based Alloys (No Lead)

View All

Indium Corporation Blog Posts

Reflow of Copper Pillar Microbumps

Monday, June 10, 2013 by Dr. Andy Mackie [view bio]

Waferbumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste printing (with all its concerns of voiding, coplanarity, stencil-life, and spatter) to plated solderbumps, and now to plated copper pillars with microbumps…

The Limits of Mixing: A Chocolate Chip Example

Thursday, May 30, 2013 by Dr. Ron Lasky [view bio]

Folks, We tend to think of mixing as something that can completely even out those things being mixed.  As an example, let’s assume you are making chocolate chip cookies and would like to have 10 chocolate chips in each large cookie.  You make enough batter for 100 cookies and then…

NanoBond® used for Data Generation

Thursday, May 30, 2013 by Jim Hisert [view bio]

“The standard process was used as described: The pieces were assembled with a reactive multilayer foil between the aluminum and molybdenum, with a compliant foam layer over them and an aluminum spacer block on top of the foam. This stack was loaded into a hydraulic press and compressed to 3MPa.…

View All Blog Posts

Indium Corporation does not recommend, manufacture, market, or endorse any of our products for human consumption.

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Claire Mikolajczak

This page is owned by:

Claire Mikolajczak
Director, Metals & Compounds
cmiko@indium.com

INDIUM CORPORATIONwww.indium.comaskus@indium.comPRC +86 (0)512 628 34900SINGAPORE +65 6 268 8678UK +44 (0) 1908 580400USA +1 315 853 4900

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