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Indium Corporation Blog Posts
Reflow of Copper Pillar Microbumps
Waferbumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste printing (with all its concerns of voiding, coplanarity, stencil-life, and spatter) to plated solderbumps, and now to plated copper pillars with microbumps…
The Limits of Mixing: A Chocolate Chip Example
Folks, We tend to think of mixing as something that can completely even out those things being mixed. As an example, let’s assume you are making chocolate chip cookies and would like to have 10 chocolate chips in each large cookie. You make enough batter for 100 cookies and then…
NanoBond® used for Data Generation
“The standard process was used as described: The pieces were assembled with a reactive multilayer foil between the aluminum and molybdenum, with a compliant foam layer over them and an aluminum spacer block on top of the foam. This stack was loaded into a hydraulic press and compressed to 3MPa.…
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