NanoFoil® and NanoBond®
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Indium Corporation develops and manufactures NanoFoil® to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Customers around the world have discovered the unique benefits of NanoFoil® and NanoBond® to solve their current engineering and mass production challenges.
What is NanoFoil®
NanoFoil® is a new class of nano-engineered material. It is fabricated by vapor-depositing thousands of alternating nanoscale layers of Aluminum (Al) and Nickel (Ni). When activated by a small pulse of local energy from electrical, optical or thermal sources, the foil reacts to precisely deliver localized heat up to temperatures of 1500°C in fractions (thousandths) of a second.
Today, this localized heat is used in many bonding applications ranging from the bonding of sputter targets to backing plates, to the attaching of a component such as an LED to a circuit board.
How to Become a User of NanoFoil®
NanoFoil® is available in a variety of thicknesses and compositions to provide a range of reaction velocities, temperatures and energy suitable for numerous applications.
Visit the NanoBond® and Applications section of our web site to see if we are currently providing production ready solutions for your application. You can also buy a NanoFoil® Sample Kit to try out our technology first-hand, or you can contact our sales team at Indium Corporation to discuss your specific needs.
NanoFoil® for High-Temperature Applications
Features
- Rapid, controlled, locally-applied heat source
- Instantaneous, flux-free soldering and brazing at room temperature
- Suitable for use with high-temperature solders or brazes
- Enables high-strength bonds between most combinations of materials
Introduction
As a sacrificial heat source in soldering and brazing applications, NanoFoil® is ideal for high-temperature applications. NanoFoil® becomes a non-functional part of the solder or braze joint, eliminating the need for an oven or furnace and allowing for the use of higher temperature solders.
NanoFoil® can also be used as a reaction initiator in standard sheet or powder form. The NanoFoil® can be produced based on customer specifications, including reaction velocity and output energy.
Non-bonding applications can also take advantage of the controlled energy released in the NanoFoil® reaction. The metallic reaction does not require an oxidizer and does not generate gas. This allows NanoFoil® to be used as a primer to initiate secondary reactions. The controlled reaction rate of NanoFoil® can be tailored to a range of design criteria, which is ideal for fuses and delays.
Applications
- Reaction initiation
- Reaction delay
- Fuses
- Joining of dissimilar materials in large area formats, such as sputtering targets, armor, and other rigid assemblies
- Soldering or brazing of temperature-sensitive electronics components or assemblies.
Forms of NanoFoil®
NanoFoil® is available in a range of thicknesses from 40-150μm in free-standing forms to cover any bonding geometry including:
- Sheets
- Preforms
- Powders
Preform packaging includes tape & reel and waffle packs.
NanoFoil® Properties
| Composition Before Reaction | Alternating layers of Ni and Al |
|---|---|
| Composition After Reaction | Ni50Al50 |
| Foil Density | 5.6-6.0 g/cm3 |
| Heat of Reaction | 1050-1250 J/g |
| Reaction Velocity | 6.5-8 meters/second |
| Maximum Reaction Temperature | 1350°-1500°C (2460°-2730°F) |
| Thermal Conductivity | 35-50 W/mK |
| RoHS Compliant | Pb-free |
