NanoFoil®
NanoFoil® Blog Posts
An Alternative Approach to Sputtering Target Bonding
A traditionally bonded sputtering target experiences a wide range of temperatures over its life cycle. It is bonded at over 200°C – usually almost 300°C for Sn/Ag/Cu bonding. Since this is the temperature it is bonded at, all changes in temperature will expand or contract the materials.…
NanoBond® is a Fluxless Process
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…
High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®
In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at the show (presented by Jacques Mateau) regarded another very interesting topic. The paper, High Temperature, Pb-Free, Metallic Sputtering Target Bonding…





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