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NanoFoil®

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NanoFoil® A reactive multi-layer foil that provides localized heat up to 1500°C in a nanosecond!
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Indium Corporation manufactures NanoFoil®, a nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics and heating applications.

NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs while providing repeatable and reliable bonds and reactions.

Indium Corporation has scaled NanoFoil® production to high volume in an ISO certified process and is committed to helping customers realize the technical and economic benefits NanoFoil® provides.

This reactive multi-layer foil is fabricated by vapor-depositing thousands of alternating nanoscale layers of Aluminum (Al) and Nickel (Ni). When activated by a small pulse of local energy from electrical, optical or thermal sources, the foil reacts exothermically to precisely deliver localized heat up to temperatures of 1500°C in fractions (thousandths) of a second.

Traveling approximately eight meters per second, the reaction's rapid delivery coupled with its localized and versatile nature makes it ideal for many types of bonding and reaction initiation (energetics) applications.

NanoFoil® Reactive Multi-Layer Foil Reaction

NanoFoil Reactive Multi-Layer Foil Reaction

Benefits of NanoFoil®

Customers around the world have discovered the unique benefits of NanoFoil® and NanoBond® to solve their current bonding challenges.

  • Instantaneous soldering at room temperature
  • No thermal damage - components not exposed to reflow temperatures
  • Fluxless
  • Compatible with all solders
  • Environmentally friendly, Pb free, and RoHS compliant
  • No license fees
  • Elimination of expensive reflow equipment
  • Easy to ignite with heat, electrical or laser pulse
  • Electrically conductive
  • Minimal pressure required
  • Safe and shipped around the world daily
  • 10x drop in thermal resistance over conventional thermal interface materials
  • Available in any 2D shape
  • Compatible with all Pick and Place equipment

Applications of NanoFoil®

  • Sputtering Target Bonding
  • Electronics Assembly
  • Thermal Management
  • Energetics

Forms of NanoFoil®

  • Sheets
  • Preforms

NanoFoil® Technical Documents

Whitepapers

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A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly

Authors: Ronnie Spraker

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Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)

Authors: Jim Hisert

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NanoBond® Assembly - A Rapid, Room Temperature Soldering Process

Authors: Indium Corporation

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Stress-Free Bonding of Large Linear Sputtering Targets for LCD Displays

Authors:

Presentations

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Application Notes

NanoBond®: The Process for Using NanoFoil® (A4)
NanoBond® of Ceramic and Metal Sputtering Targets (A4)
NanoBond® of Ceramic and Metal Sputtering Targets (US Letter)
NanoBond®: The Process for Using NanoFoil® (US Letter)

Product Data Sheets

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Safety Data Sheets

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NanoFoil® Blog Posts

When do I need to put a second activation tab on my NanoFoil® design?

15 Jun 2015 by Derrick Herron [view bio]

Frequently, in my role as a Technical Support Engineer, I am asked questions to which I may not immediately have an answer. Luckily, Indium Corporation has a team of experts here to back me up.   The other day I was working...

Read More

Industry Trend - Underwater Soldering

01 Apr 2015 by Jim Hisert [view bio]

As more and more of the electronics industry moves toward (SMA) Subaquatic Microelectronics Assembly, questions have arisen regarding safety aspects, solder joint quality, and reflow profiling. We believe all 3 of these concerns...

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Best of 2013: NanoFoil®, Tabbing Ribbon, Metals & Compounds, and Great People

19 Dec 2013 by Jim Hisert [view bio]

Thank you to all of the readers who have followed Indium Corporation’s blog posts this year, and a special “thank you” to all the readers who have contacted us to learn more. I’ve personally found...

Read More

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For comments or questions about the content on this page, please contact:

Tim Jensen
Product Manager for Engineered Solder Materials
tjensen@indium.com

From One Engineer to Another®

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Sputtering Target Bonding

NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lower capex.

Click here to learn more about Sputtering Target Bonding.

Electronics Assembly

Electronics Assembly Diagram

NanoFoil® is used to melt adjoining solder layers and join components together without exposing components to reflow temperatures. Better yet, the joining process is simple and fast.

The process is performed in air and at room temperature, it has no flux requirement, and it is completed in fractions of a second with no reflow equipment.

Thermal Management

The NanoBond® process can be used to solder a component, circuit board or a heat spreader directly to a heat sink to achieve thermal performance that is 6 to 8 times better than that of polymer-based TIM.

Advantages:

  • Outstanding Thermal Performance
  • True Metallic Bond without exposure to Reflow Temperatures
  • Residual Stresses Minimized
  • Flux Free
  • In Air at Room Temperature
  • One Second Soldering

Energetics

NanoFoil® is well-suited for energetics applications such as propellant ignition, munitions and circuit protection applications. NanoFoil® utilizes controlled, localized heat, and can be engineered to deliver a broad range of reaction temperatures, reaction rates and reaction energies.

Contact us with your specific application.

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