Applications of NanoFoil®
Sputtering Target Bonding
NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lower capex.
NanoFoil® is used to melt adjoining solder layers and join components together without exposing components to reflow temperatures. Better yet, the joining process is simple and fast.
The process is performed in air and at room temperature, it has no flux requirement, and it is completed in fractions of a second with no reflow equipment.
The NanoBond® process can be used to solder a component, circuit board or a heat spreader directly to a heat sink to achieve thermal performance that is 6 to 8 times better than that of polymer-based TIM.
- Outstanding Thermal Performance
- True Metallic Bond without exposure to Reflow Temperatures
- Residual Stresses Minimized
- Flux Free
- In Air at Room Temperature
- One Second Soldering
NanoFoil® is well-suited for energetics applications such as propellant ignition, munitions and circuit protection applications. NanoFoil® utilizes controlled, localized heat, and can be engineered to deliver a broad range of reaction temperatures, reaction rates and reaction energies.Contact us with your specific application.
NanoFoil® Technical Documents
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Product Data Sheets
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Safety Data Sheets
NanoFoil® Blog Posts
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From One Engineer to Another®
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