Applications of NanoFoil®
Sputtering Target Bonding
NanoFoil® and NanoBond® simplify the sputtering target bonding process allowing target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lower capex.
Click here to learn more about Sputtering Target Bonding.
Electronics Assembly
NanoFoil® is used to melt adjoining solder layers and join components together without exposing components to reflow temperatures. Better yet, the joining process is simple and fast.
The process is performed in air and at room temperature, it has no flux requirement, and it is completed in fractions of a second with no reflow equipment.
Thermal Management
The NanoBond® process can be used to solder a component, circuit board or a heat spreader directly to a heat sink to achieve thermal performance that is 6 to 8 times better than that of polymer-based TIM
Advantages:
- Outstanding Thermal Performance
- True Metallic Bond without exposure to Reflow Temperatures
- Residual Stresses Minimized
- Flux Free
- In Air at Room Temperature
- One Second Soldering
Energetics
NanoFoil® is well-suited for energetics applications such as propellant ignition, munitions and circuit protection applications. NanoFoil®, which is available in sheets, powders and particles, utilizes controlled, localized heat, and can be engineered to deliver a broad range of reaction temperatures, reaction rates and reaction energies
Contact us with your specific application.NanoFoil® Technical Documents
Application Notes
Product Data Sheets
Material Safety Data Sheets
NanoFoil® Blog Posts
NanoBond® is a Fluxless Process
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…
High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®
In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at the show (presented by Jacques Mateau) regarded another very interesting topic. The paper, High Temperature, Pb-Free, Metallic Sputtering Target Bonding…
Nanotechnology Can Be Simple
An unfortunate misconception about nanotechnology is that it needs to be cutting-edge technology. This is most likely a manufactured perception, created by all the people out there trying to sell nanotechnology as the “next big thing”. While there are huge advancements in various industries…
This page is owned by:
Seth Homer
Product Specialist for Engineered Solders and Thermal Materials
shomer@indium.com
From One Engineer to Another®
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