Electronics Assembly
The manufacture of electronics offers many challenges because of RoHS compliance and “lead free manufacturing.” Also, the continued miniaturization of system level electronics has complicated the thermal management of the products as enhanced thermal resistance characteristics are now vital.
Many components, such as high brightness LEDs (seen above), transformers, VCXO’s, crystals, and some connectors cannot withstand the 250°C temperatures in a lead free reflow oven, which results in a hand assembly operation after the typical assembly sequence. Other components such as power amplifiers need to be attached to a heatsink after SMT assembly which is extremely difficult. Also, the increased requirements for better thermal transfer, due to much tighter packaging at the component, circuit board, and system level have led customers to look for solutions beyond standard thermal adhesives, greases and tapes.
Finally, advances in the application of concentrated photo voltaic components where the equivalent of greater than 1000 suns can be applied, have also led to thermal management problems.
What if you could solve these problems using a room temperature bonding process?
NanoFoil® addresses many of today’s significant thermal management challenges encountered during the design and manufacture of electronic assemblies. NanoBond®, a joining process using NanoFoil, provides a thermal interface that is consistent with solder attach and that is created where components are exposed to much lower temperatures vs. lead-free reflow.
In addition, the bonding process is flux free which eliminates a cleaning operation and minimizes voiding in the solder bond. Our process also allows freedom in choice of solders and is compatible with dissimilar materials having a coefficient of thermal resistance (CTE) mismatch. The NanoBond process is also useable with flex circuits, metal core substrates, LTCC, and graphite heat spreaders.
