Power Electronics
SMT Assembly process techniques are used in combination with the NanoBond® process. NanoBond can be used to bond the back side of power amplifier boards to heat spreaders. Typical heat spreader surface finishes suitable for NanoBond include electroplated or reflowed tin and lead-tin. NanoBond eliminates warping and de-lamination due to reflow and provides greater heat transfer than thermal epoxy.
In addition, NanoBond can be used to bond expensive Power Amplifier packaged components to the heat spreader. This process can be used during the first manufacturing pass process and for a rework process.
Advantages:
- One Second Soldering
- Strong Metallic Bonds
- Localized Heating
- In Air at Room Temperature
- No Thermal Damage
- Lead Free
- RoHS Compliant Process
