Thermal Management
The NanoBond® process can be used to solder a component, circuit board or a heat spreader directly to a heat sink to achieve thermal performance that is 6 to 8 times better than that of polymer-based TIM solutions.
Advantages:
- Outstanding Thermal Performance
- Localized Heating
- True Metallic Bond without
- Exposure to Reflow Temperatures
- Residual Stresses Minimized
- Flux Free
- In Air at Room Temperature
- One Second Soldering
