Bond Performance/Reliability FAQs
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What is the quality of the bond?
The strength of the NanoBond® is based on the characteristics of the solder used.
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What does a cross section of a NanoBond® look like and how does this differ from that of a standard SMT joint?
As you can see from the image below, the reacted NanoFoil® remains as part of the bond.
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How do you evaluate a NanoBond®?
You can evaluate a NanoBond® using an ultrasonic C-scan imaging or high resolution X-ray imaging.
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What is the thermal conductivity of the bond?
40W/m-K
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How thick is the interface of a NanoBond®?
This is usually based on the design of the user, keeping in mind that the standard thicknesses of the NanoFoil® is usually 40, 60, or 80 microns.
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What is the typical bond strength (shear or tensile) of a NanoBond®?
Bond strength is dependent on the inherent strength and adhesion of the solder used to the components being joined. In our experience, NanoFoil® is not a limiting factor in the strength of any bond formed.
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What is the typical coverage of a NanoBond®?
A well designed NanoBonded joint will have < 98% coverage.
