Other Applications
NanoFoil® also offers a localized heat source for bonding components which minimizes exposure to high process temperatures and is compatible with all solders including RoHS compliant, Pb-free solders.
Indium Corporation has a history in solder materials for over 70 years. For new applications we often use our full simulation lab, and thermal lab to analyze all NanoBonds® as compared to standard solder joints.
Taking advantage of the inherent nature of NanoFoil, Indium Corporation continues to develop successful energetic applications.
For additional information on other applications, please visit our technical documents or contact Jacques Matteau.
