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Powders and Particles

Home » Products » NanoFoil® » Powders and Particles

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Powders and Particles
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  • Sputtering Target Bonding

Indium Corporation now offers NanoFoil® based reactive powders and particles either fabricated by PVD sputtering or mechanical processing. Powders and particles can be manufactured to specific requirements to control the heat, reaction velocity and ignition threshold.

Please contact Indium to discuss your specific requirements and to learn more.

Ni/Al Particles
Laminate Powders

Top Powders and Particles Technical Documents

  • NanoFoil® User Guide (A4)

    Application Note

  • A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (Paper)

    Technical Paper

  • Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient) (Paper)

    Technical Paper

  • NanoBond® of Ceramic and Metal Sputtering Targets (Letter) (A4)

    Application Note

Powders and Particles Technical Documents

Whitepapers

Request This Document

A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly

Authors: Amanda Hartnett, Jacques Matteau, Omar Knio, Ronnie Spraker

Posted on 19 Apr 2011

Request This Document

Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)

Authors: Jim Hisert, Thomas Acchione

Posted on 21 Jan 2011

Request This Document

NanoBond® Assembly - A Rapid, Room Temperature Soldering Process

Authors: Jacques Matteau

Posted on 14 Nov 2011

Request This Document

Room Temperature LED and D-Pak Type Component-Attach and Reliability Testing

Authors: Mario Scalzo, Thomas Acchione

Posted on 17 Mar 2011

Request This Document

Stress-Free Bonding of Large Linear Sputtering Targets for LCD Displays

Authors: A. Duckham, D.B. Deger, D.M. Lunking, E.L. Walters, H.B. Parker, J.E. Newson, M.A. Curran, N.G. Piegari, T.J. Acchione

Posted on 10 Mar 2010

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Application Notes

NanoFoil® User Guide (A4)
NanoBond® of Ceramic and Metal Sputtering Targets (Letter) (A4)
NanoBond®: The Process for Using NanoFoil (Letter)
NanoBond® Thermal Interface (Letter)

Product Data Sheets

NanoFoil® for High-Temperature Applications (Letter) (A4)
NF40 NanoFoil® for Bonding Electronics Assembly A4 (A4)

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Material Safety Data Sheets

NanoFoil®

NanoFoil® Blog Posts

NanoBond® is a Fluxless Process

Thursday, May 16, 2013 by Jim Hisert [view bio]

Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…

High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®

Tuesday, May 14, 2013 by Jim Hisert [view bio]

In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at the show (presented by Jacques Mateau) regarded another very interesting topic. The paper, High Temperature, Pb-Free, Metallic Sputtering Target Bonding…

Nanotechnology Can Be Simple

Wednesday, May 01, 2013 by Jim Hisert [view bio]

An unfortunate misconception about nanotechnology is that it needs to be cutting-edge technology. This is most likely a manufactured perception, created by all the people out there trying to sell nanotechnology as the “next big thing”. While there are huge advancements in various industries…

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Seth Homer

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Assistant Product Manager
shomer@indium.com

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