NanoFoil® preforms, a nanotechnology material, offer a simple and economical way to bond components without the need for traditional reflow equipment.
Nanofoil® preforms are frequently used as a heat source for soldering components to various substrates. When sandwiched between two or more components to be joined, either using solder pre-coated components, or using solder-plated NanoFoil® and components with solderable surfaces, NanoFoil® uniformly and precisely delivers a significant amount of heat energy across the entire area, melting the solder and creating an instantaneous bond at room temperature. Only locally heating the surface of the substrates, eliminates any heat exposure to the component being joined.
Instantaneous - creates stress free bonds in milliseconds with no need for expensive reflow ovens
No thermal damage - components not exposed to reflow temperatures; ideal for temperature-sensitive components
Fluxless - rapid flux free soldering at room temperature
Flexible - suitable for use with all solders
Environmentally friendly - Pb-free, and RoHS compliant
Elimination of expensive reflow equipment
Easy to ignite with heat, electrical or laser pulse
Thermally and Electrically Conductive - NanoFoil® becomes a non-functional part of the solder joint, yet is electrically conductive and 6x-10x more thermally conductive than non-conductive adhesives
Safe - and shipped around the world daily
Any Shape - available in virtually any shape
Compatible - with all Pick and Place equipment
Forms of NanoFoil®
NanoFoil® preforms are available in a range of thicknesses from 40-150μm in both standard NanoFoil® and solder plated NanoFoil®. NanoFoil® preforms are formed by die cutting, laser cutting or chemical etching. Simpler shapes such as circle and squares can be die cut where complex shapes are laser cut. NanoFoil® preforms are available in Tape & Reel, bulk packaging and waffle packs.
- Laser cutting - ideal for high precision complex shapes
- Stamping - economical choice for simple shapes
- Chemical Milling - ideal for high volume complex shapes where edge quality is not a concern
- Manual - NanoFoil® can be cut with glass cutters
Solder Plated NanoFoil:
Solder plated NanoFoil® preforms are used when the surfaces being bonded do not contain the necessary solder. Solder thicknesses range from 5-20um per side. Common solder plating options include:
- Please contact us with your specific plating
Preforms Technical Documents
Product Data Sheets
Safety Data Sheets
Preform Manufacturer Blog Posts
I am happy to announce that Indium Corporation will participate in the Power and High Temperature Electronics Manufacturing Experience at SMTAI. This event is coordinated by my good friend, Bob Willis. This is the first…
A Solder Alternative Utilizing Integrated Solder Preforms. Printed circuit boards containing both surface mounted and through-hole components are common in industry and, often, are referred to as "mixed technology" boards. Solder paste is used to attach the components on the surface,…
I recently caught up with Brent Boek, Supervisor of the indium cell at our Utica Business Park manufacturing facility in New York. Brent and his crew work hard to create all types of custom fabricated indium parts, from specialty indium wire to customer-specific solder preforms. For Brent and the team,…
Assistant Product Manager
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.