NanoFoil® preforms, a nanotechnology material, offer a simple and economical way to bond components without the need for traditional reflow equipment.
Nanofoil® preforms are frequently used as a heat source for soldering components to various substrates. When sandwiched between two or more components to be joined, either using solder pre-coated components, or using solder-plated NanoFoil® and components with solderable surfaces, NanoFoil® uniformly and precisely delivers a significant amount of heat energy across the entire area, melting the solder and creating an instantaneous bond at room temperature. Only locally heating the surface of the substrates, eliminates any heat exposure to the component being joined.
Instantaneous - creates stress free bonds in milliseconds with no need for expensive reflow ovens
No thermal damage - components not exposed to reflow temperatures; ideal for temperature-sensitive components
Fluxless - rapid flux free soldering at room temperature
Flexible - suitable for use with all solders
Environmentally friendly - Pb-free, and RoHS compliant
Elimination of expensive reflow equipment
Easy to ignite with heat, electrical or laser pulse
Thermally and Electrically Conductive - NanoFoil® becomes a non-functional part of the solder joint, yet is electrically conductive and 6x-10x more thermally conductive than non-conductive adhesives
Safe - and shipped around the world daily
Any Shape - available in virtually any shape
Compatible - with all Pick and Place equipment
Forms of NanoFoil®
NanoFoil® preforms are available in a range of thicknesses from 40-150μm in both standard NanoFoil® and solder plated NanoFoil®. NanoFoil® preforms are formed by die cutting, laser cutting or chemical etching. Simpler shapes such as circle and squares can be die cut where complex shapes are laser cut. NanoFoil® preforms are available in Tape & Reel, bulk packaging and waffle packs.
- Laser cutting - ideal for high precision complex shapes
- Stamping - economical choice for simple shapes
- Chemical Milling - ideal for high volume complex shapes where edge quality is not a concern
- Manual - NanoFoil® can be cut with glass cutters
Solder Plated NanoFoil:
Solder plated NanoFoil® preforms are used when the surfaces being bonded do not contain the necessary solder. Solder thicknesses range from 5-20um per side. Common solder plating options include:
- The most common solder plating is tin. Please contact us with your specific plating request.
Related Markets and Applications
Related Technical Documents
Preforms Technical Documents
Product Data Sheets
Safety Data Sheets
Preform Manufacturer Blog Posts
Phil Zarrow interviewed Derrick Herron, a technical support at The Indium Corporation.
PZ: With the advent of bottom-terminating components, one of the nemeses of the electronics assembler is voiding in the thermal ground pad of the BTC component.
DH: Voiding can lead to hot spots in the component, which will eventually lead to a shortened life span, because the component will basically burn out. Not having those voids in there will allow better heat transfer from the component down into the board and away from the component.
PZ: What are some of the approaches that Indium has taken toward mitigating this problem?
DH: In the past, we’ve tried using a thin, flat, custom-shaped solder preform for the pad itself. The only problem with that is that you need a custom preform. You need the special tooling to make that part in that shape. Now, what we’ve tried is using Solder Fortification® Preforms, which can come packaged on tape & reel, ready to use. I’ve actually got some right here. They’re ready to go and can be fully automated in the process.
Phil Zarrow: When we think of solder alloys, out there in the world, we immediately think, of course, Sn63, Sn62, and obviously the SAC alloys. What can you tell us about low-temp alloys?
Carol Gowans: Well, at Indium Corporation, we have over 200 solder alloys in our solder alloy directory. And we’ve categorized that into six solder families. The first one is gallium, which is a metal that’s liquid at room temperature, so we don’t use that a lot in the solder. And we have, in increasing temperature, the bismuth family; the indium family; of course the tin family, like you mentioned; the lead family; and the gold family. And what I’d like to focus on today are the bismuth and the indium.
Phil Zarrow: Derrick, solder preforms. What are they? Derrick Herron: Well, a solder preform is a defined shape and size of a solder alloy. It can be used in place or in conjunction with a solder paste. Solder pastes are probably more common in the industry, but solder...
Senior Product Manager,
From One Engineer to Another®
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