Preforms

NanoFoil^® preforms make component bonding simple, instantaneous and economical without the need for traditional reflow equipment.

Nanofoil^® preforms are frequently used as a heat source for soldering components to various substrates. When sandwiched between two or more components to be joined, either using solder pre-coated components, or using solder-plated NanoFoil^® and components with solderable surfaces, NanoFoil^® uniformly and precisely delivers a significant amount of heat energy across the entire area, melting the solder and creating an instantaneous bond at room temperature. Only locally heating the surface of the substrates, eliminates any heat exposure to the component being joined.

Instantaneous - creates stress free bonds in milliseconds with no need for expensive reflow ovens

No thermal damage - components not exposed to reflow temperatures; ideal for temperature-sensitive components

Fluxless - rapid flux free soldering at room temperature

Flexible - suitable for use with all solders

Environmentally friendly - Pb-free, and RoHS compliant

Elimination of expensive reflow equipment

Easy to ignite with heat, electrical or laser pulse

Thermally and Electrically Conductive - NanoFoil^® becomes a non-functional part of the solder joint, yet is electrically conductive and 6x-10x more thermally conductive than non-conductive adhesives

Safe - and shipped around the world daily

Any Shape - available in virtually any shape

Compatible - with all Pick and Place equipment

Forms of NanoFoil^®

NanoFoil^® preforms are available in a range of thicknesses from 40-150μm in both standard NanoFoil^® and solder plated NanoFoil^®. NanoFoil^® preforms are formed by die cutting, laser cutting or chemical etching. Simpler shapes such as circle and squares can be die cut where complex shapes are laser cut. NanoFoil^® preforms are available in Tape & Reel, bulk packaging and waffle packs.

Forming NanoFoil^®:

• Laser cutting - ideal for high precision complex shapes
• Stamping - economical choice for simple shapes
• Chemical Milling - ideal for high volume complex shapes where edge quality is not a concern
• Manual - NanoFoil^® can be cut with glass cutters

Solder Plated NanoFoil:

Solder plated NanoFoil^® preforms are used when the surfaces being bonded do not contain the necessary solder. Solder thicknesses range from 5-20um per side. Common solder plating options include:

• Tin
• Indium
• SAC
• Please contact us with your specific plating