NanoFoil® preforms, a nanotechnology material, offer a simple and economical way to bond components without the need for traditional reflow equipment.
Nanofoil® preforms are frequently used as a heat source for soldering components to various substrates. When sandwiched between two or more components to be joined, either using solder pre-coated components, or using solder-plated NanoFoil® and components with solderable surfaces, NanoFoil® uniformly and precisely delivers a significant amount of heat energy across the entire area, melting the solder and creating an instantaneous bond at room temperature. Only locally heating the surface of the substrates, eliminates any heat exposure to the component being joined.
Instantaneous - creates stress free bonds in milliseconds with no need for expensive reflow ovens
No thermal damage - components not exposed to reflow temperatures; ideal for temperature-sensitive components
Fluxless - rapid flux free soldering at room temperature
Flexible - suitable for use with all solders
Environmentally friendly - Pb-free, and RoHS compliant
Elimination of expensive reflow equipment
Easy to ignite with heat, electrical or laser pulse
Thermally and Electrically Conductive - NanoFoil® becomes a non-functional part of the solder joint, yet is electrically conductive and 6x-10x more thermally conductive than non-conductive adhesives
Safe - and shipped around the world daily
Any Shape - available in virtually any shape
Compatible - with all Pick and Place equipment
Forms of NanoFoil®
NanoFoil® preforms are available in a range of thicknesses from 40-150μm in both standard NanoFoil® and solder plated NanoFoil®. NanoFoil® preforms are formed by die cutting, laser cutting or chemical etching. Simpler shapes such as circle and squares can be die cut where complex shapes are laser cut. NanoFoil® preforms are available in Tape & Reel, bulk packaging and waffle packs.
- Laser cutting - ideal for high precision complex shapes
- Stamping - economical choice for simple shapes
- Chemical Milling - ideal for high volume complex shapes where edge quality is not a concern
- Manual - NanoFoil® can be cut with glass cutters
Solder Plated NanoFoil:
Solder plated NanoFoil® preforms are used when the surfaces being bonded do not contain the necessary solder. Solder thicknesses range from 5-20um per side. Common solder plating options include:
- The most common solder plating is tin. Please contact us with your specific plating request.
Related Markets and Applications
Related Technical Documents
High Brightness LED Thermal Attach with NanoBond® (US Letter)
High Temperature, Pb-Free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil (Paper)
Eliminating Bond Stress of Sputtering Targets at Operational Temperatures (Paper)
Preform Manufacturer Blog Posts
Using Solder Fortification® to improve solder joint reliability in through-hole component applications
Not all fluxes can handle the high processing temperature required for Au/Sn solder preforms.
Using Solder Fortification preforms to increase solder volume can significantly reduce voiding in QFN components
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.