Sheets
Indium Corporation offers both plated and standard (non-plated) NanoFoil® sheets.
Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page.
By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements.
- Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together.
- Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.
Standard NanoFoil®
Standard (non-plated) NanoFoil® is used when the surfaces being joined have solder present. NanoFoil® acts as the heat source that will heat up and wet the solder to create an intermetallic bond. While NanoFoil® can be used with any solder, most common are Sn, In, SAC305 and SnPb.
Solder Plated NanoFoil®
Solder plated NanoFoil® is used when the surfaces being bonded are not prewet with solder but are solderable (a surface to which solder will flow and wet to without the need of flux). Solder plated NanoFoil® will heat up and wet the solder plating to a solderable surface. Acceptable solderable surfaces include:
- ENIG: >1um
- Gold Plating: 1-15um
- Immersion Silver plating: 1-2 um
- Solder Plating: 10-15um
- Hot plate soldering: 10-250um
Indium readily offers Sn, In and SAC plated NanoFoil®. Other solders are available. Please contact us to discuss your requirements.
Properties of NanoFoil®
Related Markets and Applications
Top Sheets Technical Documents
NanoFoil® User Guide (A4)
Application Note
Eliminating Bond Stress of Sputtering Targets at Operational Temperatures (Paper)
Technical Paper
High Temperature, Pb-Free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil (Paper)
Technical Paper
NanoBond® of Ceramic and Metal Sputtering Targets (Letter) (A4)
Application Note
NanoFoil® Blog Posts
NanoBond® is a Fluxless Process
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…
High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®
In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at the show (presented by Jacques Mateau) regarded another very interesting topic. The paper, High Temperature, Pb-Free, Metallic Sputtering Target Bonding…
Nanotechnology Can Be Simple
An unfortunate misconception about nanotechnology is that it needs to be cutting-edge technology. This is most likely a manufactured perception, created by all the people out there trying to sell nanotechnology as the “next big thing”. While there are huge advancements in various industries…
This page is owned by:
Seth Homer
Product Specialist for Engineered Solders and Thermal Materials
shomer@indium.com
From One Engineer to Another®
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