NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder.
Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page.
By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements.
- Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together.
- Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.
Standard (non-plated) NanoFoil® is used when the surfaces being joined have solder present. NanoFoil® acts as the heat source that will heat up and wet the solder to create an intermetallic bond. While NanoFoil® can be used with any solder, most common are Sn, In, SAC305 and SnPb.
Solder Plated NanoFoil®
Solder plated NanoFoil® is used when the surfaces being bonded are not prewet with solder but are solderable (a surface to which solder will flow and wet to without the need of flux). Solder plated NanoFoil® will heat up and wet the solder plating to a solderable surface. Acceptable solderable surfaces include:
- ENIG: >1um
- Gold Plating: 1-15um
- Immersion Silver plating: 1-2 um
- Solder Plating: 10-15um
- Hot plate soldering: 10-250um
Indium Corporation readily offers Sn-plated NanoFoil®. Other solders are available. Please contact us to discuss your requirements.
Properties of NanoFoil®
Related Markets and Applications
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NanoFoil® Sheets Technical Documents
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NanoFoil® Blog Posts
This video discusses the use of NanoFoil® as a heat source in soldering. Keywords: Phil Zarrow, Derrick Herron, NanoFoil®, solder, thermal ...
Learn about NanoFoil™, its properties and configurations, and how it's used in soldering.
Frequently, in my role as a Technical Support Engineer, I am asked questions to which I may not immediately have an answer. Luckily, Indium Corporation has a team of experts here to back me up. The other day I was working...
Product Manager for Engineered Solders Materials
From One Engineer to Another®
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