Indium Corporation offers both plated and standard (non-plated) NanoFoil® sheets.
Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page.
By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements.
- Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together.
- Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.
Standard (non-plated) NanoFoil® is used when the surfaces being joined have solder present. NanoFoil® acts as the heat source that will heat up and wet the solder to create an intermetallic bond. While NanoFoil® can be used with any solder, most common are Sn, In, SAC305 and SnPb.
Solder Plated NanoFoil®
Solder plated NanoFoil® is used when the surfaces being bonded are not prewet with solder but are solderable (a surface to which solder will flow and wet to without the need of flux). Solder plated NanoFoil® will heat up and wet the solder plating to a solderable surface. Acceptable solderable surfaces include:
- ENIG: >1um
- Gold Plating: 1-15um
- Immersion Silver plating: 1-2 um
- Solder Plating: 10-15um
- Hot plate soldering: 10-250um
Indium readily offers Sn, In and SAC plated NanoFoil®. Other solders are available. Please contact us to discuss your requirements.
Properties of NanoFoil®
Related Markets and Applications
Top Sheets Technical Documents
NanoFoil® User Guide (A4)
Eliminating Bond Stress of Sputtering Targets at Operational Temperatures (Paper)
High Temperature, Pb-Free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil (Paper)
NanoFoil® Sheets Technical Documents
Material Safety Data Sheets
NanoFoil® Blog Posts
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