NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder.
Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page.
By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements.
- Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together.
- Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.
Standard (non-plated) NanoFoil® is used when the surfaces being joined have solder present. NanoFoil® acts as the heat source that will heat up and wet the solder to create an intermetallic bond. While NanoFoil® can be used with any solder, most common are Sn, In, SAC305 and SnPb.
Solder Plated NanoFoil®
Solder plated NanoFoil® is used when the surfaces being bonded are not prewet with solder but are solderable (a surface to which solder will flow and wet to without the need of flux). Solder plated NanoFoil® will heat up and wet the solder plating to a solderable surface. Acceptable solderable surfaces include:
- ENIG: >1um
- Gold Plating: 1-15um
- Immersion Silver plating: 1-2 um
- Solder Plating: 10-15um
- Hot plate soldering: 10-250um
Indium readily offers Sn and In plated NanoFoil®. Other solders are available. Please contact us to discuss your requirements.
Properties of NanoFoil®
Related Markets and Applications
NanoFoil® Sheets Technical Documents
Safety Data Sheets
NanoFoil® Blog Posts
As more and more of the electronics industry moves toward (SMA) Subaquatic Microelectronics Assembly, questions have arisen regarding safety aspects, solder joint quality, and reflow profiling. We believe all 3 of these concerns can be resolved by using NanoFoil®. Happy April fool’s…
Thank you to all of the readers who have followed Indium Corporation’s blog posts this year, and a special “thank you” to all the readers who have contacted us to learn more. I’ve personally found it to be a very exciting year, and I’d like to point out a few posts…
We recently worked with a company called Lambda Technologies who has helped by providing a new solution to activating NanoFoil®: microwaves. Shown in the picture here is the MC3100 VFM. (The VFM stands for variable frequency microwave) As you may know by now, activating NanoFoil is all about…
Product Manager for Strategic Accounts
From One Engineer to Another®
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unless specifically stated otherwise.