Sputter Target Bonding
NanoFoil® and NanoBond® - The Complete Solution for Sputter Target Bonding
The NanoBond process is designed to meet and exceed performance expectations in a wide variety of thin film deposition applications. As a simplified assembly method for bonding sputter targets, NanoBond offers the most comprehensive performance features and benefits to the end user.
Features
- Room temperature bonding
- Uniform bondline thickness
- High melting temperature solder
- Minimized stress from CTE mismatch
- Minimal voiding – up to 99% coverage
Benefits
- Superior high temp performance
- Enables higher sputtering rates
- Uniform film deposition
- Increased yield
- Improved reliability
- Increased operational uptime
- Increase in manufacturing throughput
What Makes this Technology the Right Choice for Bonding Sputter Targets?
NanoFoil enables a high quality, high melting temperature solder bond between a sputtering target and a backing plate. The NanoBond process allows the user to increase sputtering rates by 30-100%. NanoBond produces a strong, flat, low stress bond that is highly thermally and electrically conductive. NanoFoil works by acting as a local heat source to melt adjacent solder layers without heating the target or backing plate materials. This allows the bonding of nearly any combination of sputter target material and backing plate material, including ceramics to metals, irrespective of the difference in coefficient of thermal expansion (CTE).
